The Product Development Engineering Intern will contribute to the development and support of Broadband Plasma (BBP) wafer inspection tools. The internship provides hands-on experience in product development, BBP wafer inspection tool performance characterization, and cross-functional collaboration. The BBP division develops optical inspection systems used by logic, foundry, and memory customers to detect critical defects at advanced nodes. The intern will assist with system health checks, calibration, troubleshooting, and data collection; analyze images and other data collected through machine control software; and participate in system characterization and validation to verify performance against engineering requirements. The role also involves designing and running experiments, documenting and presenting results, and developing scripts or utilities to automate data analysis, testing, and engineering processes. The position is based in Milpitas, California. The listed base pay range is $47.00–$56.00 per hour, based on pursuit of a master’s or Ph.D. Interns are eligible for some of the benefits described in the posting.
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Job Type
Full-time
Career Level
Intern