Producibility Engineer II

Honeywell Aerospace•Richardson, TX

2d•Onsite

About The Position

As a Producibility Engineer II here at Honeywell, you will support MMIC products across post-production and development phases, including wafer probe, packaging, and final RF test. This role focuses on monitoring test yields and product performance through detailed electrical analysis (S-parameters, power, gain, efficiency), driving yield improvements, and leading root cause investigations for performance variability and defects. The engineer develops and optimizes test methodologies, correlates wafer-level and packaged results and ensures robust test documentation and production readiness. In product development, the role includes test fixture and PCB design, lab-based RF characterization, and data analysis to define product specifications and improve device models and design kits. The position works closely with design, process, and test teams to resolve issues, validate models through measurement and back-fitting, and support high-frequency package design. Additional responsibilities include failure analysis support (SEM, FIB, electrical methods), prototype assembly, inspection, and preparation of technical reports to enable successful product release and delivery. You will report directly to our Engineering Program Manager, and you’ll work out of our Richardson, TX location on an On-site work schedule. In this role, you will impact the successful execution of producibility engineering projects that align with business objectives, contributing to revenue growth, customer satisfaction, and market competitiveness. Your technical skills and collaboration will help Honeywell develop and launch innovative aerospace products that meet evolving customer needs.

Requirements

Electrical analysis (S-parameters, power, gain, efficiency)
Test fixture and PCB design
Lab-based RF characterization
Data analysis
Failure analysis support (SEM, FIB, electrical methods)
Prototype assembly
Inspection
Technical report preparation

Responsibilities

Support MMIC products across post-production and development phases, including wafer probe, packaging, and final RF test.
Monitor test yields and product performance through detailed electrical analysis (S-parameters, power, gain, efficiency).
Drive yield improvements.
Lead root cause investigations for performance variability and defects.
Develop and optimize test methodologies.
Correlate wafer-level and packaged results.
Ensure robust test documentation and production readiness.
Test fixture and PCB design.
Lab-based RF characterization.
Data analysis to define product specifications and improve device models and design kits.
Work closely with design, process, and test teams to resolve issues.
Validate models through measurement and back-fitting.
Support high-frequency package design.
Failure analysis support (SEM, FIB, electrical methods).
Prototype assembly, inspection.
Preparation of technical reports to enable successful product release and delivery.