A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate it’s leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future. At TSMC Arizona, Process Technicians are not just operators—they are the production guardians of the most advanced semiconductor fab in the U.S. When you are on shift, you hold direct responsibility for production stability, making time-critical decisions, and ensuring billions of transistors are manufactured flawlessly. Your judgment directly affects wafer yield, line stability, and multi-million-dollar tool performance. Module Process Technician Our Process Technicians are assigned to specialized engineering modules, such as Lithography (LIT), Etch (ETC), Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), Diffusion (DIF), Epitaxy (EPI), Chemical Mechanical Polish (CMP), Metrology (ME), and Yield Excellence (YED). Each module plays a critical role in semiconductor manufacturing, and technicians are trusted to maintain stability and quality within their assigned area.
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Job Type
Full-time
Career Level
Entry Level
Education Level
High school or GED