Process Integration/Lithography Engineer

Xanadu•Albany, NY

1d•$110,000 - $150,000

About The Position

About Xanadu Xanadu’s mission is to build quantum computers that are useful and available to people everywhere. At Xanadu, we are learners, innovators, researchers, collaborators and problem solvers. We are creating something that has never been built before. What we are doing is extremely hard, the classic moon shot. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world’s most challenging problems, and literally change the world. And that is something to be excited about! Your role and responsibilities: As an industry leader in photonic quantum computing, Xanadu takes hardware very seriously! In this role, you will work within the Fabrication Process Engineering team to deliver Xanadu’s photonic quantum computing hardware. With your deep technical expertise and strong experience in photonics fabrication process development and process integration, you will be responsible for developing process integration schemes used to build critical components of Xanadu’s quantum computing hardware. Process Integration & Quantum Hardware Development: Coordinate between several internal component teams to ensure all hardware requirements are satisfied in delivered chips and circuits. Innovate in the space of photonic process development and process integration, especially with respect to ultra-low loss components. Collaborate with internal and external photonics process engineers to refine fabrication procedures for ultra-low loss photonic quantum computing chips. Work with Xanadu’s foundry partners to continuously improve lithography approach while balancing competing fabrication requirements. Deliver integrated quantum photonics chips and circuits containing multiple active and passive components. Lithography & Tapeout Ownership: Build, define, and own the entire photolithography and tapeout module from layout receipt to final wafer patterning. Receive GDS design files and manage the tapeout cycle with external mask shops. Define the exact specifications for OPC aggressiveness, dummy fill density rules, and Optical Rules Check (ORC) targets. Develop and enforce the Lithography Design Rule Manual and provide critical Design for Manufacturing (DFM) feedback to layout teams. Define scanner illumination conditions and tune Numerical Aperture/Sigma settings to maximize process windows. Execute rigorous focus/exposure matrices, optimize photoresist/BARC chemistries, and establish metrology baselines to ensure strict CD and overlay control. Stay abreast of new developments in the fields of photonics fabrication process development and advanced patterning.

Requirements

MS, or Ph.D. in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or a related technical field.
5+ years experience in a foundry environment for semiconductor and/or integrated photonics products, including experience owning lots, working with an MES, etc.
Familiarity with standard semiconductor and photonics metrology and failure analysis techniques, including some subset of: SEM, TEM, AFM, defect inspection, ellipsometry, XRR/XRD, SIMS, Raman spectroscopy.
Familiarity with photonic components, such as waveguides, beamsplitters, resonators, MZIs, etc.
Deep, hands-on expertise with advanced 300mm scanners.
Demonstrated experience managing tapeout cycles, specifying mask requirements, and reviewing ORC/OPC verification data.
Ability to tackle challenging problems and develop innovative solutions.
Excellent communication skills and strong sense of teamwork.

Nice To Haves

Experience building lithography modules within a mature technology flow.
Strong understanding of advanced mask writing technologies and the fundamental physics of lithographic imaging.
Experience owning lots in SiView MES.
Experience with product development cycle from R&D through volume ramping.
Experience in photonic quantum computing hardware development.
Demonstrated track record of delivering finished integrated photonics products.
Experience working in fabless companies.
Preferred location: Albany, NY area.

Responsibilities

Coordinate between several internal component teams to ensure all hardware requirements are satisfied in delivered chips and circuits.
Innovate in the space of photonic process development and process integration, especially with respect to ultra-low loss components.
Collaborate with internal and external photonics process engineers to refine fabrication procedures for ultra-low loss photonic quantum computing chips.
Work with Xanadu’s foundry partners to continuously improve lithography approach while balancing competing fabrication requirements.
Deliver integrated quantum photonics chips and circuits containing multiple active and passive components.
Build, define, and own the entire photolithography and tapeout module from layout receipt to final wafer patterning.
Receive GDS design files and manage the tapeout cycle with external mask shops.
Define the exact specifications for OPC aggressiveness, dummy fill density rules, and Optical Rules Check (ORC) targets.
Develop and enforce the Lithography Design Rule Manual and provide critical Design for Manufacturing (DFM) feedback to layout teams.
Define scanner illumination conditions and tune Numerical Aperture/Sigma settings to maximize process windows.
Execute rigorous focus/exposure matrices, optimize photoresist/BARC chemistries, and establish metrology baselines to ensure strict CD and overlay control.
Stay abreast of new developments in the fields of photonics fabrication process development and advanced patterning.