Process Integration Engineer

Micron Technology • Boise, ID

5d • Onsite

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are undergoing a historic expansion with our new fabrication facility in Boise, ID. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. As a Process Integration Engineer (PIE) for our Advanced Technology and Engineering team, you will learn to work very closely with global teams to drive process integration across multiple different groups. This position will be working with the PIE team to transfer and introduce the DRAM node from Technology Development (TD) or other HVM fab to our new state of the art manufacturing facility at the Boise fab including yield ramp, cost reduction and quality improvement to production level. You will cooperate and coordinate with central team, other fabs, TD, quality team, design team to implement the best in class known methods and BKM to Boise Expansion (ID1).

Requirements

• Bachelor's degree with a minimum 3 years of HVM or FAB experience
• 3 years of experience working with Memory (DRAM preferred)
• 2 years of experience in semiconductor fabrication areas such as yield ramp, reduction of cost, and quality improvement.
• Clear understanding of transistor operations, scaling limitations and reliability
• Be prepared to work a shifted schedule as required.

Nice To Haves

• Master's or Ph.D. degree in Material science, Electrical, Electronics, Chemical or Engineering areas
• Experience with TD, Process Integration, Device, Yield analysis, QR
• Experience working with 300mm semiconductor environment.
• Solid knowledge of tech transfer and development
• Experience in SWR, process transfer, module ownership, ramp up, trend sustaining

Responsibilities

• Act as a module owner to conduct root cause investigations and failure analysis in time-sensitive environments.
• Drive improvements in yield, cost efficiency, and quality.
• Run Design of Experiments (DOE) to enhance process capability and margin.
• Address top detractors to improve device yield and reliability.
• Lead workshops during technology transfer for next-generation devices.
• Start up, develop, and optimize processes for product quality and reliability.
• Coordinate and execute process, equipment, and material evaluations.
• Validate and qualify new processes, tools, and materials for new product introduction.

Benefits

• choice of medical, dental and vision plans
• benefit programs that help protect your income if you are unable to work due to illness or injury
• paid family leave
• robust paid time-off program
• paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level