Intel Process Integration Engineer - (BE)

Intel•Hillsboro, OR

1d•Onsite

About The Position

The Intel Foundry MDCE and Logic Technology development (LTD) organizations deliver process technology innovation to drive Intel's product roadmap. This role offers opportunities to transform technology and create a better future by delivering products that touch the lives of every person on earth. Intel fosters a collaborative, supportive, and exciting environment where the brightest minds come together to achieve exceptional results. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages compute devices. The company ensures its foundry customers' products receive utmost focus in terms of service, technology enablement, and capacity commitments.

Requirements

PhD degree in one of these fields: Electrical Engineering, Physics, Applied Physics, Optics, Material Science, Chemical Engineering, Mechanical Engineering, or related discipline.
6+ months experience on one or more of the following areas: Semiconductor device fabrication or nanotechnology.
6+ months experience on one or more of the following areas: Electrical characterization of transistors or other semiconductor devices.
6+ months experience on one or more of the following areas: Clean room process development.

Nice To Haves

JMP, MATLAB, Scripting languages (1.e. Python, JSL, TCL), or programming languages (1.e. SQL, C/C++).
Strong understanding of Device physics (CMOS, FinFET, GAA, etc).
Hand on experience in VLSI device fabrication and testing in the lab.
Knowledge of basic VLSI fabrication instruments (1.e. mechanism of dry etcher, ALD (atomic layer deposition), PE CVD, metallization, etc.).
Understanding statistical process control and charting methodology data flow and integrity.
Strong data analysis and presentation acumen.
Integrated process knowledge, including strong design of experiments and model-based problem-solving skills for complex problems, excursions, and defects.
Knowledge of automation and defect classification systems in a fab environment.
Strong stakeholder management and influencing skills.
Experience in coordination with other departments, co-workers, etc.

Responsibilities

Develop and define integrated process flows for interconnect modules.
Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, dielectric, and metrology teams.
Optimize RC (resistance-capacitance) performance.
Establish process windows and integration schemes.
Identify BE-driven yield loss mechanisms such as open and short defects, metal voids, low k ILD damage, etc.
Perform root cause analysis using statistical tools (SPC, DOE, FMEA).
Drive corrective actions to improve yield and cycle time.
Implement control plans and process monitoring strategies.
Use statistical tools such as: Cpk / Ppk, Control charts, Capability analysis.
Ensure margins for electromigration, stress migration, TDDB, time dependent via degradation.
Evaluate impact of process window shifts on reliability.
Support ramp from RnD to high-volume manufacturing (HVM).
Document process specifications and standard operating procedures (SOPs).
Collaborate with Device Engineering.
Collaborate with Equipment Engineering/Module Engineering.
Collaborate with Yield Engineering.
Collaborate with Reliability Teams.
Collaborate with Design Teams.