Intel Process Integration Engineer - (FE)

Intel•Hillsboro, OR

1d•$103,730 - $198,820•Onsite

About The Position

Join Intel and build a better tomorrow. The Intel Foundry MDCE and Logic Technology development (LTD) organizations delivers process technology innovation to drive Intel's product roadmap. We give you opportunities to transform technology and create a better future by delivering products that touch the lives of every person on earth. As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results.

Requirements

Candidate must possess a PhD degree in one of these fields: Electrical Engineering, Physics, Applied Physics, Optics, Material Science, Chemical Engineering, Mechanical Engineering, or related discipline.
Candidate must possess at least one of the following: 6+ months experience on one or more of the following areas: Semiconductor device fabrication or nanotechnology.
Electrical characterization of transistors or other semiconductor devices.
Clean room process development.

Nice To Haves

JMP, MATLAB, Scripting languages (1.e. Python, JSL, TCL), or programming languages (1.e. SQL, C/C++).
Strong understanding of Device physics (CMOS, FinFET, GAA, etc)
Hand on experience in VLSI device fabrication and testing in the lab.
Knowledge of basic VLSI fabrication instruments (1.e. mechanism of dry etcher, ALD (atomic layer deposition), PE CVD, metallization, etc.)
Understanding statistical process control and charting methodology data flow and integrity.
Strong data analysis and presentation acumen.
Integrated process knowledge, including strong design of experiments and model-based problem-solving skills for complex problems, excursions, and defects.
Knowledge of automation and defect classification systems in a fab environment.
Strong stakeholder management and influencing skills.
Experience in coordination with other departments, co-workers, etc.

Responsibilities

Develop and define integrated front end process flows for new technology nodes.
Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, and metrology teams.
Establish process windows and integration schemes.
Analyze yield loss and parametric failures.
Perform root cause analysis using statistical tools (SPC, DOE, FMEA).
Drive corrective actions to improve yield and cycle time.
Ensure electrical parameters meet design targets.
Work closely with device engineers to tune process conditions.
Optimize critical dimensions (CD), overlay, and film thickness.
Implement control plans and process monitoring strategies.
Use statistical tools such as: Cpk / Ppk, Control charts, Capability analysis
Support ramp from RnD to high-volume manufacturing (HVM).
Document process specifications and standard operating procedures (SOPs).
Work with Device Engineering, Equipment Engineering/Module Engineering, Yield Engineering, Reliability Teams, and Design Teams.