Process Integration Engineer | APTD

Micron Technology • Boise, ID

1d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Technology Development (TD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage solutions that transform how the world uses information. This team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and manufacturing teams, we ensure the efficient transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Join this forward-thinking team that is molding the future of technology! As a Process Integration Engineer within APTD your responsibilities include but are not limited to developing and enabling deployment of advanced interconnect technologies. Successful development and deployment will ensure that products which use the developed technologies meet performance, cost, manufacturability, quality, reliability and schedule requirements. Also, you will have responsibility to work with peers and internal partners across organizations to coordinate the development and launch of new technologies and integration flows. This role is open to candidates at Process Engineer Levels 4, 5 or MTS.

Requirements

• 3+ years of professional experience in the semiconductor industry.
• MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or a closely related field, or equivalent professional experience demonstrating senior‑level technical capability.
• Professional experience in process integration, process development, advanced packaging, or closely related semiconductor technology domains within an R&D environment (IDM, foundry, OSAT, or equivalent).

Nice To Haves

• End‑to‑end ownership of integration solutions, from technology definition and process development through qualification and high‑volume manufacturing transfer.
• Deep, hands‑on expertise in advanced packaging and interconnect technologies, including 2.5D/3DIC integration, wafer‑level and fan‑out packaging.
• Practical experience with interconnect methods such as wirebond, microbump, and/or hybrid bonding.
• Strong semiconductor technology background with experience in memory (DRAM, NAND) and/or logic devices.
• Proven strength in process integration problem‑solving using DoE, data‑driven decision making, and root‑cause analysis.

Responsibilities

• Collaborate with peers, internal teams, and external suppliers to develop innovative advanced packaging technologies.
• Deliver reliable, efficient packaging solutions on schedule with predictable performance.
• Define project timelines and validation plans to qualify new technologies.
• Enable smooth transitions from development and qualification through low‑ and high‑volume production.
• Anticipate future trends and define technology roadmaps for advanced packaging solutions.
• Continuously develop technical and leadership skills through ongoing learning.
• Promote and enforce a culture of safety, compliance, and ethical behavior.
• Maintain procedures, training, and audit readiness to ensure regulatory and management system compliance.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees