BEOL Process Integration Engineer

Texas InstrumentsLehi, UT
Onsite

About The Position

Texas Instruments is seeking a BEOL Process Integration Engineer for its LFAB in Lehi, Utah, a state-of-the-art 300mm manufacturing facility. This role is part of the Advanced Technology Development (ATD) organization, which focuses on creating technology for advanced 28nm analog and embedded process technology. ATD engineers are responsible for solving complex problems in analog semiconductor development, from Resolution Enhancement Techniques and OPC models to precision wet process chemistries. The facility aims to manufacture tens of millions of analog and embedded processing chips daily, built on the process technologies developed and qualified by this team. The company is committed to responsible, sustainable manufacturing and community impact through job creation and K–12 STEM education investments. In this position, the engineer will work at the intersection of fundamental research and high-volume manufacturing, transforming process innovations into production-ready technologies. The primary responsibility is to drive the integration and development of the overall BEOL in advanced lithography nodes, such as 28/22nm and beyond.

Requirements

  • Master’s degree in Electrical Engineering, Materials Science & Engineering, or related degree
  • 5+ years of experience in 28nm & below technology with hands-on experience developing BEOL
  • Demonstrated experience and ability to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries

Nice To Haves

  • Ph.D. degree in Electrical Engineering, Materials Science & Engineering, or related degree
  • Experience with 28/22nm technology development for BEOL including RRAM (Resistive Random Access Memory), TFR (Thin Film Resistor), MIMCAP (Metal-Insulator-Metal Capacitor), if possible
  • Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
  • Strong verbal and written communication skills
  • Ability to quickly ramp on new systems and processes
  • Demonstrated strong interpersonal, analytical and problem-solving skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Ability to take the initiative and drive for results
  • Strong time management skills that enable on-time project delivery

Responsibilities

  • Ownership of the process flow for BEOL that meets physical, electrical, yield and reliability targets
  • Working closely with the unit process development group to design experiments to evaluate multiple integration options and arrive at an optimized, manufacturable and cost-effective solution
  • Partnering with the RET team to validate OPC and make improvements, as appropriate
  • Collaborating with the silicon-package-test interaction (SPTI) team to ensure silicon process is compatible with test and packaging robustness requirements
  • Accountable for delivering technology solutions on time that meet product requirements
  • Plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel
  • Lead technical discussions in their area of expertise
  • Work effectively across organizational boundaries
  • Clearly communicate project status and actions
  • Interface with multiple organizations and work well on a diverse team to accomplish goals
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