New College Grad - Process Integration Engineer, APTD

Micron Technology • Boise, ID

11d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Technology Development (TD) department at Micron Technology leads innovation. It drives the advancement of data retention and storage systems that change how the world uses information. The team develops next-generation semiconductor processes and technologies and works closely with global R&D and manufacturing teams to bring innovative solutions from concept to production. Join a collaborative environment where you will help shape the future of semiconductor technology while working alongside experienced engineers and technical leaders. As a Process Integration Engineer in Advanced Packaging Technology Development (APTD), your role includes developing advanced packaging approaches and linking technologies. You will contribute to their integration in future semiconductor products. Working in a highly collaborative R&D environment, you will support process development, technology evaluation, and qualification activities while gaining hands-on experience with modern semiconductor technologies. This role provides an excellent opportunity for engineers who are passionate about innovation, problem-solving, and continuous learning.

Requirements

• Master's degree or equivalent experience in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or a related engineering/science field.
• Knowledge of semiconductor manufacturing, process integration, materials engineering, device physics, or advanced packaging through coursework, research, internships, or industry experience.
• Demonstrated analytical and problem-solving skills through academic research, internships, laboratory work, or engineering projects.
• Ability to work effectively in a collaborative, multi-functional team environment and communicate technical concepts clearly.
• Experience using data analysis tools and a willingness to learn AI-assisted technologies that improve engineering productivity and decision-making.

Nice To Haves

• Internship, co-op, research, or academic project experience related to semiconductor process development, advanced packaging, materials characterization, or manufacturing technologies.
• Familiarity with advanced packaging concepts such as wafer-level packaging, fan-out packaging, 2.5D/3D integration, wirebond, microbump, or hybrid bonding.
• Experience analyzing experimental data using statistical methods, Design of Experiments (DoE), or related engineering techniques.
• Understanding of semiconductor devices, memory technologies (DRAM/NAND), or logic process technologies.
• Demonstrated leadership, initiative, or project ownership through research, student organizations, internships, or team-based engineering projects.

Responsibilities

• Support the development, characterization, and integration of groundbreaking packaging and interconnect solutions for next-generation semiconductor products.
• Collaborate with multi-functional engineering teams to analyze process data, solve technical challenges, and improve technology performance.
• Participate in experiments, process evaluations, and technology qualification activities to support development objectives.
• Utilize AI-enabled and data-driven tools to analyze engineering results, identify trends, and support technical decision-making.
• Promote a culture of safety, quality, compliance, and continuous learning.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level