Process Integration Engineer (Writer) (49947)

HEADWAY TECHNOLOGIES INC•Milpitas, CA

35d•Onsite

About The Position

Under the direction of the Sr. Director of Process Characterization/NPI, the Process Integration Engineer (Writer) is responsible for the process integration and characterization of prototype wafers for new technology programs and next generation projects, including performing wafer level process characterization, conducting failure analysis on prototype wafers and recommending corrective action, and reviewing, monitoring, and analyzing backend performance data. This position is located in Milpitas, California.

Requirements

Bachelor’s degree in Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; Master’s or PhD degree preferred
Six years of hands-on experience working in the process integration or characterization in a semiconductor environment in a manufacturing or process engineering role
Hands-on experience using JMP or similar analytical application
Proficient in the use of Microsoft Office Applications
Knowledge of process integration and characterization principles, practices, and techniques
Knowledge of magnetic recording head or HDD manufacturing
Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
Able to design experiments, analyze results, and recommend corrective action
Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
Able to work productively and collaboratively with all levels of employees and management
Able to comply with all safety policies and procedures
Able to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements
Demonstrated analytical skills
Demonstrated organizational and time management skills
Demonstrated problem-solving and trouble shooting skills
Flexible and able to prioritize

Nice To Haves

Master’s or PhD degree preferred

Responsibilities

Develops and delivers process integration and characterization techniques for new technology programs and next generation products
Conducts failure analysis on newly developed processes and recommends corrective action if necessary
Participates in characterization or integration projects of various scope and complexity; ensures they are completed within the established timeframe
Performs wafer level process characterization on thin film recording heads using Focused Ion Beam (FIB) tool to identify defects and recommends corrective action
Reviews and analyzes backend performance data and makes recommendations to improve performance
Designs and conducts experiments to verify process robustness; analyzes data and reports findings
Analyzes data using JMP, MS Visual Basic, or similar software application to determine the root cause of process variations; develops charts or reports and presents findings before groups or teams
Responds to inquiries from other team members, managers, or departments
Adheres to all safety policies and procedures as required
Performs other duties of a similar nature or level