Process Integration Development Engineer

Intel•Hillsboro, OR

2d•Onsite

About The Position

Intel leads the semiconductor industry by creating innovative technologies. This is an opening for a TEM Metrology Engineer in Hillsboro, Oregon, focusing on transmission electron microscopy (TEM) metrology data generation and analysis. This position is for day shift in the TEM Metrology group, supporting manufacturing process development for the next generation of Intel chips. The role involves partnering with Integration, Module, inline Defect Metrology, and Yield Analysis groups by providing critical dimension TEM data for manufacturing process control and yield improvement. The successful candidate will require a strong analytical TEM background with extensive metrology data collection and statistical TEM analysis experience in nano-scale materials or semiconductor devices. Experience in automated metrology method development, building infrastructure and interfaces, extracting various dimensional data from images, image processing, and BE/FE development to streamline automated data processing, along with other metrology-related skillsets, will be necessary to perform the role's duties. This is a cross-functional role requiring close collaboration with the automated TEM tool operation team and internal TEM automated metrology development engineers. Clear communication and strong teamwork are essential. A continuous upgrading of skillsets with an open attitude and the ability to learn from colleagues are also needed.

Requirements

Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, or related technical field.
At least 4+ years of industry and technical experience.
Knowledge of semiconductor manufacturing processes or experience working in a high-volume manufacturing environment with statistical analysis, design of experiments (DOE), SPC, or structured problem-solving methodologies.
Strong analytical and problem-solving skills, with the ability to leverage data to identify trends, investigate root causes, and support engineering decisions.
Experience using programming languages and data analysis and visualization tools such as Python, SQL, Power BI, and Tableau to analyze manufacturing or engineering data.
Must be a good team player and able to work efficiently and independently.

Nice To Haves

Ph. D. in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, or related technical field with 4+ years of industry experience.
Hands-on TEM experience on semiconductor devices using various analytical techniques including FIB sample preparation and chemical analysis.
Experience with tools such as Python and OpenCV to perform tasks related to all aspects of development, including data extraction, end-to-end automation pipeline design, and data filtering.
Experience with machine learning, predictive analytics, computer vision, or AI-based engineering projects.
Experience with software development practices, including version control (Git), REST APIs, front-end or back-end development, database design, or cloud-based applications.

Responsibilities

Generate and analyze transmission electron microscopy (TEM) metrology data.
Support manufacturing process development for next-generation Intel chips.
Provide critical dimension TEM data for manufacturing process control and yield improvement.
Develop automated metrology methods.
Build infrastructure and interfaces for metrology systems.
Extract and analyze dimensional data from images.
Perform image processing.
Streamline automated data processing through BE/FE development.
Collaborate with automated TEM tool operation teams.
Work internally with TEM automated metrology development engineers.
Continuously upgrade skillsets and learn from colleagues.