Process Integration Development Engineer

Intel Corporation•Hillsboro, OR

1d•$120,860 - $170,630•Onsite

About The Position

Intel leads the semiconductor industry by creating innovative technologies. This is openings to TEM metrology Engineer in Hillsboro, Oregon, focusing on transmission electron microscopy (TEM) metrology data generation and analysis. This is for day shift positions in TEM metrology group supporting manufacturing process development for next generation of Intel chip with Integration, Module, inline Defect metrology and Yield analysis group partners by providing critical dimension TEM data for manufacturing process control and yield improvement. The successful candidates require strong analytical TEM background with massive metrology data collection and statistical TEM analysis experiences in nano-scale materials or semiconductor device. Experience on automated metrology method development, building infrastructure and interface, various dimensional data mining from images, image processing, and BE/FE development to streamline automated data processing and other skillsets related metrology will be required to perform the roles. This is a cross-functional role position working closely with automated TEM tool operation team as well as working internally with TEM automated metrology development engineers that requires clear communication and strong collaboration as one team. Continuous upgrading of skillset with open attitude and ability to learn from colleague are needed.

Requirements

Master's degree in Materials Science, Chemical engineering, Mechanical Engineering, Electrical Engineering, or related technical field.
At least 4+ years of industry and technical Experience in: Knowledge of semiconductor manufacturing processes or experience working in a high-volume manufacturing environment with statistical analysis, design of experiments (DOE), SPC, or structured problem-solving methodologies.
Strong analytical and problem-solving skills, with the ability to leverage data to identify trends, investigate root causes, and support engineering decisions.
Experience using programming languages and data analysis and visualization tools such as Python, SQL, Power BI, and Tableau to analyze manufacturing or engineering data.
Good team player and able to work efficiently and independently.

Nice To Haves

Ph. D. in Materials Science, Chemical engineering, Mechanical Engineering, Electrical Engineering, or related technical field with 4+ years of industry experience.
Hands-on TEM experience on semiconductor device using various analytical techniques including FIB sample preparation and chemical analysis.
Experience with tools such as python and OpenCV to perform tasks related to all aspects of development, including data extraction, end-to-end automation pipeline design, and data filtering.
Experience with machine learning, predictive analytics, computer vision, or AI-based engineering projects is considered a strong plus.
Experience with software development practices, including version control (Git), REST APIs, front-end or back-end development, database design, or cloud-based applications.

Responsibilities

Focusing on transmission electron microscopy (TEM) metrology data generation and analysis.
Supporting manufacturing process development for next generation of Intel chip with Integration, Module, inline Defect metrology and Yield analysis group partners by providing critical dimension TEM data for manufacturing process control and yield improvement.
Performing automated metrology method development, building infrastructure and interface, various dimensional data mining from images, image processing, and BE/FE development to streamline automated data processing.
Working closely with automated TEM tool operation team.
Working internally with TEM automated metrology development engineers.
Communicating technical findings and reliability risks to stakeholders in a clear and concise manner.
Applying new technologies to solve challenges.