Process Engineering Manager - Molding, Ball & Die Attach, Bonding, Wet Etch and Cleans
About The Position
The Process Engineering Manager leads a team of process engineers and technical contributors responsible for wafer fabrication process development, sustaining, yield improvement, and technology transfer across assigned modules. The role provides senior technical and people leadership in a cleanroom manufacturing environment. Its primary scope includes molding, ball and die attach, bonding, wet etch, cleans, related metrology, module-level integration support, process control, qualification, and transfer. The broader process areas mentioned include thin films, dry etch, plating, and electrochemical processing. The manager sets clear goals and leads performance management, coaching, employee development, and succession planning. The role builds technical capability through process ownership, knowledge sharing, and delegation of meaningful technical responsibilities. It also leads process development, optimization, qualification, and sustaining; drives structured root-cause investigations and yield and defect improvements; and partners across functions to resolve technical issues, support new technology introductions, ensure compliance, and communicate priorities, risks, and resource needs to leadership. The position requires at least 15 years of experience in a wafer fabrication cleanroom environment and at least two years of leadership, supervisory, or management experience. U.S. citizenship is required, and the position requires holding or being able to obtain a government security clearance. The annual salary range is $136,960–$205,440, with pay determined by factors including job-related experience, skills, education, and credentials.
Requirements
- B.S., M.S., or Ph.D. in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, or another relevant engineering discipline.
- At least 15 years of experience in a wafer fabrication cleanroom environment.
- At least two years of leadership, supervisory, or management experience, preferably with direct people leadership responsibility.
- Experience as a process or area owner for at least two relevant process areas, such as molding, ball and die attach, bonding, wet etch, or cleans-related module processes.
- Experience in CMOS, MEMS, photonics, photovoltaic, or heterogeneous integration/advanced packaging fabrication environments.
- Demonstrated experience leading structured problem-solving using 8D, 3D, Fishbone, 5 Why, fault-tree analysis, or similar methodologies.
- Strong working knowledge of DOE, SPC, process capability analysis, and statistical methods, with the ability to teach and lead others in their application.
- Ability to lead cross-functional teams, manage multiple technical priorities, and deliver results in a fast-paced manufacturing or development environment.
- Strong interpersonal skills and ability to influence, coach, and develop engineers and technical staff.
- Excellent written and verbal communication skills.
- Ability to meet commitments, manage multiple projects simultaneously, and shift priorities based on business needs.
- Passion for leading teams, developing people, and building strong engineering capability.
- U.S. citizenship.
- Must hold or be able to obtain a government security clearance.
Nice To Haves
- Experience with wet etch, wet cleans, and contamination control.
- Experience supporting advanced materials, specialty semiconductor processes, or customer-specific process flows.
- Advanced degree in engineering, materials science, physics, or a related technical field.
- Experience supporting both process development and production sustaining environments.
- Experience supporting government, aerospace, defense, or other high-reliability customer programs.
- Experience with security-sensitive manufacturing environments.
Responsibilities
- Lead the engineering team through goal setting, performance management, coaching, development, and succession planning.
- Build technical capability by strengthening process ownership, enabling knowledge sharing, and delegating technical responsibilities.
- Drive process development, optimization, qualification, and sustaining across molding, attach, bonding, wet etch, cleans, and related metrology processes.
- Lead root-cause investigations, corrective actions, and yield and defect improvements using statistical, DOE, and process-capability methods.
- Partner cross-functionally to resolve complex technical issues and support new technology introductions.
- Ensure compliance and communicate priorities, risks, and resource needs to leadership.
- Support module-level integration, process control, sustaining, development, qualification, and technology transfer.
Benefits
- 401(k) match.
- Life insurance.
- Opportunity to purchase SkyWater stock at a discounted rate.
- Incentive plans and other employee financial benefits.
- Comprehensive benefits package with eligibility beginning on day one.
- Medical benefits.
- Dental benefits.
- Mental health benefits.
- Vision benefits.
- Legal planning.
- Short- and long-term disability.
- Paid time off.
- Paid holidays.
- On-site fitness facility.
- On-site self-serve market.
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What This Job Offers
Job Type
Full-time
Career Level
Manager
