About The Position

The Process Engineering Intern will help improve the productivity of Lam Research’s Dielectric Films Deposition products in customer fabs. Working with a mentor and experienced engineers, the intern will diagnose issues that limit tool throughput and uptime. Each intern owns one primary project matched to business needs and background; Ph.D. interns take on larger, more open-ended work. By the end of the summer, the intern will own a defined project and present results to DFBU leadership. Example projects include reducing chamber recovery time, developing preventive parts-replacement recommendations, and creating a fleet productivity dashboard.

Requirements

  • Must be an M.S. or Ph.D. student in Chemistry, Physics, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or Materials Science/Engineering.
  • Strong academic standing and returning to school after the internship.
  • Strong foundational understanding of physical sciences, including thermodynamics and physical chemistry.
  • Strong communication skills to convey project summaries and results.
  • Ability to work in a clean-room environment while wearing personal protective equipment and a clean-room suit or smock.

Nice To Haves

  • Background in data science or AI/machine-learning-based process development.
  • Coursework or lab experience in thin films, CVD, or plasma processing.
  • Experience with thin-film analytical methods such as SEM/TEM, XPS, XRD, or ellipsometry.
  • Familiarity with problem-solving methods such as SPC, DOE, 5-why, or 8D.
  • Experience analyzing data with Python, JMP, or MATLAB.

Responsibilities

  • Run experiments on dielectric deposition tools in lab and clean-room environments, and analyze film and metrology data.
  • Apply model-based and machine learning approaches to predict and prevent productivity losses.
  • Analyze tool and fleet data, including uptime, downtime, and chamber recovery, to identify improvement opportunities.
  • Support root-cause investigations and preventive parts-replacement plans to reduce downtime and wafer scrap.
  • Present findings and recommendations to engineering and leadership in a short technical memo.
  • Own a primary project and present project results to DFBU leadership.
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