3DGS is hiring new college graduates into a 24-month Process Engineering Rotational Program at its Albuquerque wafer fab. Participants complete two 12-month rotations across process modules, each with a dedicated mentor and a defined project, before placement into a permanent process engineering role based on their interests, performance, and business needs. Process engineers own the recipes, equipment performance, and yield of the steps that turn bare glass into working chips. From the first week, participants work on live production problems affecting output, cost, and quality. Rotations cover Photolithography, Etch, Thin Films (CVD / PVD / ALD), Electroplating, and Yield and Integration. Work may include critical dimension and overlay control, resist processes, reticle qualification, wet etch recipe development, film thickness and uniformity control, copper electroplating, and connecting inline data and electrical testing to defects and process shifts. Typical tools and methods include exposure and track tools, overlay metrology, single and batch processing, deposition chambers, ellipsometry, XRF, stress gauges, electroplate tools, profilometry, defect inspection, wafer maps, parametric testing, and statistical analysis. The position is full-time, exempt, and on-site in Albuquerque, New Mexico. The stated experience level is 0–5 years. Compensation is $75,000–$100,000 DOE. The company offers mentorship, regular project reviews with senior engineers and fab leadership, and benefits including medical, dental and vision coverage, an IRA, paid time off and holidays, tuition assistance, and relocation support. A sign-on bonus or paid relocation and equity may also be available based on experience.
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Job Type
Full-time
Career Level
Entry Level