Process Engineer 4

Lam Research•Albany, NY

11h

About The Position

The Process Engineer will work in Lam Research’s Office of the CTO, developing and evaluating processes for semiconductor equipment and systems. The role uses atomic precision, materials science, and surface engineering to advance process formulations, equipment hardware requirements, and process compatibility. It contributes to deposition process development for sub-2nm CMOS logic nodes and to next-generation semiconductor product development. The position leads thin-film deposition (CVD, ALD, and plating) process development projects supporting Lam–IBM joint development agreements. It includes collaborating with customer process and hardware engineers to develop solutions and troubleshoot process and hardware interactions; presenting results to internal and external audiences; and being cross-trained in dry etch, wet clean, and process integration. The role also provides direction to process technicians.

Requirements

Master’s degree in Materials Science, Chemical Engineering, Chemistry, Physics, or a related field and 6 or more years of experience; or a PhD and 3 or more years of experience; or equivalent experience.

Nice To Haves

Familiarity with laboratory work and semiconductor equipment, including surface preparation and analytical techniques.
In-depth understanding of Statistical Process Control (SPC) and/or Design of Experiments (DOE).
High proficiency in MATLAB, Python, or a similar scientific computing language.
Working knowledge of statistical analysis and problem-solving methodologies.
Experience with statistical tools such as JMP or Minitab.
Background in Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), or Physical Vapor Deposition (PVD).
Background in plasma physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP), or Capacitively Coupled Plasma (CCP).
Knowledge of material synthesis and material characterization.
Experience working collaboratively in a matrixed environment with diverse teams, semiconductor customers, and/or partners.
Experience in semiconductors, process design, deposition, etching dielectrics or conductors, or metal films.
Experience with advanced wafer processing equipment.

Responsibilities

Conduct process engineering research, development, and evaluation for semiconductor equipment and systems.
Review and improve processing techniques and methods used in product manufacture and fabrication.
Develop and sustain processes and process improvements to reduce production costs and increase yields.
Compile and analyze test data to guide process development and establish process specification limits and variables.
Plan customer demonstrations, collect data, analyze results, and report on existing process applications.
Partner with internal teams and customers to understand roadmaps, process flows, inflection points, requirements, and business challenges.
Contribute to next-generation product development and release activities supporting the semiconductor roadmap.
Provide leadership, direction, and guidance to process technicians.
Lead thin-film deposition (CVD, ALD, and plating) process development projects supporting Lam–IBM joint development agreements.
Collaborate with customer process engineers to develop solutions.
Collaborate with customer process and hardware engineers to troubleshoot hardware and process problems and interactions.
Be cross-trained in dry etch, wet clean, and process integration.
Develop creative solutions in process design and applications.
Present results internally and externally to engineers, executives, customers, and other audiences.