Process Engineer 5

Lam Research • Fremont, CA

5d • $125,000 - $270,000

About The Position

The Process Engineer will develop and optimize advanced etch processes for specialty semiconductor and advanced packaging applications within Lam Research’s Customer Support Business Group and Reliant Etch Technology team. The role supports technologies such as 3D integration, HBM, heterogeneous packaging, and AI-driven computing, helping customers address manufacturing challenges and move new solutions from concept to production.

The engineer will lead experiments and analyze process data to improve performance, yield, and productivity; define process and hardware requirements; establish robust process windows; and solve complex technical challenges. The role also involves planning and presenting customer demonstrations and technology evaluations, collaborating with customers and cross-functional teams, contributing to next-generation product development and releases, and supporting adoption of new manufacturing technologies at customer sites worldwide.

The position requires a bachelor’s degree with 12 or more years of related industry experience, a relevant master’s degree with 8 or more years of industry experience, a relevant PhD with 5 or more years of industry experience, or an equivalent combination of education and professional experience. The posting states that Lam offers different work-location models based on role needs, including hybrid models, but does not identify the specific model for this position. The listed salary range applies to applicants who reside or work onsite in the California, San Francisco Bay Area: $125,000 to $270,000.

Requirements

• Bachelor’s degree and 12 or more years of related industry experience; or a master’s degree in Materials Science, Chemical Engineering, Chemistry, Physics, or a related field and 8 or more years of industry experience; or a PhD in a relevant technical discipline and 5 or more years of industry experience; or an equivalent combination of education and professional experience.

Nice To Haves

• Strong experience in semiconductor process development, including etch, deposition, dielectric, conductor, and metal film technologies.
• Deep understanding of advanced packaging technologies and integration schemes.
• Hands-on experience with frame-form plasma dicing technologies, including wafer handling systems, process integration, and plasma etch development.
• Strong background in plasma physics and plasma processing technologies, including Reactive Ion Etching (RIE), Inductively Coupled Plasma (ICP), and Capacitively Coupled Plasma (CCP).
• Experience with deep silicon etch, plasma dicing, TSV, HBM, 3D integration, or related advanced packaging technologies.
• Knowledge of material synthesis, surface modification, and materials characterization techniques.
• Proficiency in statistical analysis, Design of Experiments (DOE), and structured problem-solving methodologies.
• Ability to work effectively in a collaborative, cross-functional environment with engineering teams, customers, and external partners.
• Strong communication and presentation skills, including the ability to influence technical decisions and customer adoption strategies.
• A proven track record of delivering innovative process solutions from development through production implementation.

Responsibilities

• Develop and optimize advanced etch processes for specialty semiconductor and advanced packaging applications.
• Design, execute, and analyze experiments to advance process development and improve performance, yield, and productivity.
• Define process and hardware requirements in response to evolving technology and customer needs.
• Analyze process and experimental data to establish robust process windows and solve complex technical challenges.
• Plan, execute, and present results from customer demonstrations and technology evaluations.
• Collaborate with customers and cross-functional teams to develop solutions and support technology roadmaps.
• Contribute to next-generation product development and technology releases.
• Drive the introduction and adoption of new semiconductor manufacturing technologies at customer sites worldwide.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior