Process Engineer - Thin Film

TSMC•Camas, WA

5d•$87,000 - $115,580•Onsite

About The Position

Join TSMC Washington and help power the future of technology. At TSMC, we don't just make semiconductors; we innovate to transform industries and enhance lives. As the world’s leading semiconductor foundry, we partner with top tech companies to drive advancements in industries such as healthcare, automotive, consumer electronics, and renewable energy. At TSMC Washington, you'll thrive where innovation meets precision manufacturing, and integrity guides our high standards and customer trust. Our visionary leaders collaborate with clients to achieve groundbreaking results, ensuring our leadership in the semiconductor sector. Explore career opportunities with TSMC Washington and join a company with a commitment to excellence and innovation. We are seeking a motivated and detail-oriented Entry-Level Process Engineer to join our dynamic semiconductor manufacturing team. In this role, you will receive hands-on training and mentorship to monitor, maintain, and optimize our state-of-the-art semiconductor fabrication processes. This is an excellent opportunity for a recent graduate or early-career professional to build a strong foundation in high-volume manufacturing (HVM) and collaborate with global industry leaders.

Requirements

Bachelor’s degree (BS) or higher in Chemical Engineering, Chemistry, Electrical Engineering, Physics, Materials Science, or a related STEM field.
0 to 2+ years of experience in a high-volume manufacturing semiconductor Fab (highly relevant internships, co-ops, or academic cleanroom experience will be strongly considered).
Prior exposure to or experience with CVD (Chemical Vapor Deposition) or PVD (Physical Vapor Deposition) tools is preferred.
Basic understanding of thin film process principles; familiarity with semiconductor equipment or process integration is a plus.
Strong foundational data analysis capabilities, with an eagerness to learn advanced techniques (e.g., commonality checks, Design of Experiments (DOE)).
Strong multi-tasking skills with the ability to balance, prioritize, and execute multiple tasks to meet deadlines in a fast-paced environment.
Ability to work collaboratively with Manufacturing, Equipment, and other engineering teams to achieve quality and capacity goals.
Strong interpersonal and communication skills, with the ability to work effectively across cross-functional and geographically dispersed teams.
Initiative-driven with a flexible mindset; able to adapt priorities and responsibilities to support evolving business and production needs.
A team player who exhibits early leadership potential and thrives in dynamic, fast-paced environments.
Goal-driven with an appreciation for high-performing team cultures.
Quick to assimilate and master new technologies and methodologies.
A logical thinker skilled in troubleshooting complex problems to address root cause.
Ability to remain stationary for extended periods, primarily while working at a desk, with occasional movement around the facility.
Frequent use of a computer, which involves looking at screens for extended durations.
Occasionally required to carry items weighing up to 12 pounds.
Occasionally reach, bend forward while standing, or squat.
Ability to spend majority of shift on feet, both walking and standing, with occasional sitting.
All applicants must possess legal authorization to work in the United States. Please note that we are unable to provide sponsorship or take over sponsorship of an employment visa at this time.
Candidates must successfully pass a background check and a drug screening. Please note, in compliance with Washington state regulations, the drug screen will not test for cannabis (marijuana) use.

Nice To Haves

Prior exposure to or experience with CVD (Chemical Vapor Deposition) or PVD (Physical Vapor Deposition) tools is preferred.
Basic understanding of thin film process principles; familiarity with semiconductor equipment or process integration is a plus.
Eagerness to learn advanced techniques (e.g., commonality checks, Design of Experiments (DOE)).

Responsibilities

Learn and utilize Statistical Process Control (SPC), Real-Time Monitoring (RTM) methods, and other data sources to monitor process performance, ensuring stability and identifying areas for improvement.
Partner with manufacturing, equipment, and integration teams to troubleshoot line issues, support new technology transfers, and assist in developing solutions to improve process quality, productivity, and cost reduction.
Participate in cross-functional meetings, including occasional collaboration with overseas partners (such as TSMC in the Asia time zone).
Show commitment to business needs by assisting with abnormal event handling and urgent fab support when required to meet production goals.