Process Engineer Senior

Arizona State University•Mesa, AZ

8d•Hybrid

About The Position

The Advanced Electronics and Photonics Core Facility seeks a qualified candidate for a senior process engineering position. The candidate will mainly be focused on the wafer prep and finishing areas of the advanced packaging process; these areas include die attach, molding, grinding, wafer saw, and ball drop/reflow. Primary areas of responsibility will include process development on our forthcoming 300mm wafer packaging toolsets as well as equipment ownership of the dicing saw and wafer grinders. As part of a multi-disciplinary team, you will interact with individuals responsible for areas such as device physics, deposition, etching, photolithography, and electrical test to ensure robust wafer packaging processes that meet the precise physical and electrical requirements for our customers. As part of the AEP Core operations team, you will help to maintain the wafer prep and finishing process areas by supporting operations and increasing equipment up time, responding to production issues, implementing solutions, reducing costs, and improving yields. In this position, you will support existing processes, develop new processes, identify process and material improvements, and develop intellectual property. You will also use statistical process controls and data analysis to support and monitor the performance of the equipment. Customer service is an integral part of the senior process engineer position. The candidate will be interacting directly with a wide variety of students, faculty, and other professionals to provide services as requested. Skill in communicating technical ideas in a positive and patient manner is a must. This position is funded by the DoD, which requires candidates to be US citizens due to ITAR/Export Control and clearance level activity. This position may be subject to additional screening in the hiring process.

Requirements

Bachelor's degree and five (5) years of experience appropriate to the area of assignment/field; OR, Any equivalent combination of experience and/or training from which comparable knowledge, skills and abilities have been achieved.
US citizens due to ITAR/Export Control and clearance level activity.

Nice To Haves

Master’s degree in engineering or related field and seven (7) years of engineering or related experience including responsibility for tool and process requirements; OR, any equivalent combination of experience and/or education from which comparable knowledge, skills and abilities have been achieved.
Demonstrated understanding of the operation and maintenance of molding, grinding, die attach, ball drop, and/or wafer saw equipment.
Strong interpersonal communication skills
Strong customer service skills
Computer knowledge used for documentation and analysis.
MS in Chemical Engineering, Materials Engineering, Physics or related discipline.
Demonstrated strong mechanical aptitude and experience with statistical software packages such as JMP or Minitab.
Demonstrated experience with active matrix TFT processing and amorphous-silicon processes.
Demonstrated experience with semiconductor advanced packaging processing.
Experience with many disciplines including etching, deposition, cleaning, and other thin film processing.
Equipment maintenance experience.

Responsibilities

Maintain wafer prep and finishing by supporting operations, increasing equipment up time, responding to production issues, keeping the equipment under statistical control, and reducing costs.
Assist students, faculty, and other professionals with service requests
Recommend, scope, and assist in the procurement and installation of future equipment into the Core.
Cross-train in other areas to provide backup and assistance as needed.
Write procedures to help students and other users safely use the equipment.
Provide supervision and guidance to the users of the Core.