Process Engineer III - Dry Etch

Fujifilm•Santa Clara, CA

1d•Onsite

About The Position

Develop and improve wafer fab processes. Own tools and processes run on them, minimizing yield loss and maximizing process performance. Provide production support engineering for a specific product or group of products (inkjet print heads) during and after transfer from design to production. Sustain products with cost reduction and yield improvement efforts. Interface with other engineers to solve technical problems. Work closely with R&D and manufacturing engineering to qualify new tools and processes for volume production. This job is fully qualified, career-oriented, journey-level position. Works on problems of diverse scope where analysis of data requires evaluation of identifiable factors. Demonstrates good judgment in selecting methods and techniques for obtaining solutions. Networks with senior internal and external personnel in own area of expertise. Normally receives little instruction on day to day works, general instructions on new assignments.

Requirements

Bachelor’s degree in Engineering, Material Science, Chemistry, or Physics with a minimum of 8 years relevant experience. Experience should include process and design engineering work in a MEMS wafer fab.
Must have related experience in Plasma Etching, Ash, photo processes...
Ability to find root causes of wafer fab problems.
Excellent problem identification and problem-solving skills.
Ability to apply advanced mathematical concepts such as exponents, logarithms, quadratic equations, and permutations.
Ability to apply mathematical operations to such tasks as frequency distribution, determination of test reliability and validity, analysis of variance, correlation techniques, sampling theory, and factor analysis.
Ability to respond to common inquiries or complaints from internal resources and customers.
Must have excellent written, verbal and presentation skills, in order to effectively present information to subordinates, customers and management.

Nice To Haves

Master’s degree with 6 years of experience or PhD with 3 years of experience.
Equivalent work experience.

Responsibilities

Develop and improve wafer fab processes (Silicon Oxide, Deep Silicon, Ion Mill...etch processes).
Use and run wafer metrology tools to analyze problems, failures and other technical issues.
Use good problem solving and project management skills to solve the wide array of technical product problems.
Communicate especially well and motivate others outside and inside the department to resolve problems and accomplish work through various company resources.
Organize technical problem solving strategies clearly and present them effectively to all concerned parties.
Use statistical process control (SPC), design of experiments (DoE), and yield data to help resolve or correct all identified problems.