Process Engineer – Die to Wafer Hybrid Bonding

Applied Materials•Santa Clara, CA

74d•$147,000 - $202,500•Onsite

About The Position

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. Join the Photonics Platforms Business Group at Applied Materials’ Santa Clara headquarters, where you will work with a cross-functional research team to develop cutting-edge 2.5D/3D advanced packaging technologies. We are seeking hands on Process Engineers to drive die to wafer (D2W) hybrid bonding R&D. This role focuses on hybrid bonding process development, pathfinding, technology de risking, and advanced packaging integration exploration. The role provides on the job training and hands on experience with state of the art equipment, including the industry’s first fully integrated die to wafer hybrid bonding system.

Requirements

Ph.D. or M. S. in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline.
In depth knowledge and hands on experience in one or more of the following: Die to wafer or wafer to wafer hybrid bonding, Thin die handling and alignment critical processes, Micro-LED or CPO experience, Heterogeneous integration such as III-V to Si, novel materials to Si 2.5D/3D integration, Direct process engineer experience on mainstream semiconductor equipment (plasma, wet clean, overlay/alignment, etc.)
Strong understanding of: Bond interface physics, Alignment and overlay fundamentals, Mechanical behavior of thin and fragile dies
Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP).
Self starter with strong problem solving skills; able to work both independently and collaboratively with minimal supervision.
Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.

Responsibilities

Develop die to wafer hybrid bonding processes, including (but not limited to): Surface preparation and plasma activation, High accuracy die placement and alignment, Post bond characterization and process evaluation
Integrate D2W bonding with adjacent process modules such as: Dicing and die preparation, Die thinning, Inter die gap fill and planarization
Design and execute DOE driven experiments to understand process limits, sensitivities, and trade offs.
Own process optimization, perform failure analysis and characterization, and drive continuous engineering improvement.