Principal Die-to-Die Interconnect Modeling Architect

Broadcom•Fort Collins, CO

1d•$167,500 - $268,000

About The Position

We are seeking a Modeling Architect to lead a technical team in building and evolving our foundational modeling platform for die-to-die (D2D) PHYs designs. This role focuses on communication theory, algorithm development, system-level modeling, performance prediction, adaptation algorithm modeling, and architectural verification. The successful candidate will perform evaluation and tradeoff analysis using statistical tools over different signaling schemes (e.g., NZR vs. other), and analyze hardware architecture and implementation tradeoffs (equalization, error terms, noise budgets, etc.). Leading a technical team, the architect will drive algorithm verification of Verilog implementations, predictive adaptation algorithm run-time modeling, Monte Carlo evaluations of adaptation algorithms, and architectural verification with silicon correlation to achieve high model-to-silicon alignment. This role requires deep technical understanding of communication algorithms, timing and margin budgeting, equalization and error term analysis, and focus on cross-functional technical leadership.

Requirements

MS in Electrical Engineering, Computer Engineering, and 15 or more years in related field experience; or PhD in Electrical Engineering, Computer Engineering, and 12 or more years in related field experience.
Deep understanding of communication theory, equalization, and adaptive algorithms.
Experience in high-speed SerDes, or D2D communication systems architecture.
Extensive experience developing behavioral and architectural models using MATLAB, Python, SystemC, or equivalent tools.
Experience with architecture model to RTL to verification
Experience leading architectural verification, silicon correlation, and performance validation across multidisciplinary engineering teams.

Nice To Haves

Demonstrated expertise in D2D, UCIe, or other short-reach die-to-die communication.
Expertise in advanced packaging including silicon interposers, EMIB, hybrid bonding, and 3D integration.
Management experience

Responsibilities

Develop comprehensive behavioral and architectural models that accurately predict complete link behavior before implementation.
Build system-level models using MATLAB, Python, SystemC, or equivalent modeling environments.
Model transmitter, receiver, package, channel, clocking, equalization, adaptation, and protocol interactions.
Predict link performance including BER, latency, throughput, bandwidth density, power consumption, energy efficiency, and manufacturing margin.
Perform architectural sensitivity analyses across process, voltage, temperature (PVT), aging, package variation, jitter, noise, and channel impairments.
Apply communication theory to help develop robust, high-performance signaling architectures.
Analyze equalization, timing recovery, clock recovery, calibration, and adaptive signal processing algorithms.
Evaluate convergence behavior, numerical stability, hardware efficiency, and implementation feasibility.
Guide algorithm development from mathematical concepts through production silicon implementation.
Model deterministic and random timing uncertainties including jitter, skew, supply noise, process variation, and environmental effects.
Establish margin methodologies that ensure robust operation across manufacturing and operating conditions.
Collaborate with implementation teams to ensure timing assumptions are achievable in silicon.
Define the architectural verification strategy to ensure system requirements are traceable from concept through production silicon.
Develop behavioral reference models that serve as the golden standard for RTL implementation, verification, software development, and silicon validation.
Establish architecture-level performance metrics, verification methodologies, and success criteria.
Drive correlation between behavioral models, RTL simulation, laboratory characterization, and production silicon.
Validate architectural assumptions through simulation and silicon measurements, identifying performance gaps and driving corrective actions.
Develop verification methodologies that account for implementation effects including finite precision, analog non-idealities, and hardware constraints.
Define comprehensive validation strategies covering nominal operation, corner cases, interoperability, and robustness across all operating conditions.
Provide technical leadership across architecture, analog, digital, firmware, packaging, signal integrity, verification, validation, and product engineering organizations.
Lead architecture reviews and critical technical decision-making throughout the product lifecycle.
Mentor engineers and architects in communication systems, modeling, and architecture development.
Influence technology roadmaps and drive innovation in next-generation die-to-die communication systems.