Process Engineer – Die to Wafer Hybrid Bonding

Applied Materials • Santa Clara, CA

54d • $124,000 - $171,000 • Onsite

About The Position

Join the Photonics Platforms Business Group at Applied Materials’ Santa Clara headquarters, where you will work with a cross-functional research team to develop cutting-edge 2.5D/3D advanced packaging technologies. We are seeking hands‑on Process Engineers to drive die‑to‑wafer (D2W) hybrid bonding R&D. This role focuses on hybrid bonding process development, pathfinding, technology de‑risking, and advanced packaging integration exploration. The role provides on‑the‑job training and hands‑on experience with state‑of‑the‑art equipment, including the industry’s first fully integrated die‑to‑wafer hybrid bonding system.

Requirements

• Ph.D. or M.S. in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline.
• In‑depth knowledge and hands‑on experience in one or more of the following: Die‑to‑wafer or wafer‑to‑wafer bonding, Thin‑die handling and alignment‑critical processes, Micro-LED or CPO experience, Heterogeneous integration such as III-V to Si, novel materials to Si, 2.5D/3D integration, Direct process engineer experience on mainstream semiconductor equipment (plasma, wet clean, overlay/alignment, etc.)
• Strong understanding of: Bond interface physics, Alignment and overlay fundamentals, Mechanical behavior of thin and fragile dies
• Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP).
• Self‑starter with strong problem‑solving skills; able to work both independently and collaboratively with minimal supervision.
• Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.

Responsibilities

• Develop die‑to‑wafer hybrid bonding processes, including (but not limited to): Surface preparation and plasma activation, High‑accuracy die placement and alignment, Post‑bond characterization and process evaluation
• Integrate D2W bonding with adjacent process modules such as: Dicing and die preparation, Die thinning, Inter‑die gap fill and planarization
• Design and execute DOE‑driven experiments to understand process limits, sensitivities, and trade‑offs.
• Own process optimization, perform failure analysis and characterization, and drive continuous engineering improvement.

Benefits

• Supportive work culture that encourages learning, development, and career growth
• On-the-job training and hands-on experience with state-of-the-art equipment
• Comprehensive benefits package
• Eligibility for other forms of compensation such as participation in a bonus and a stock award program

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level