Printed Circuit Board (PCB) Layout Engineer

Hewlett Packard Enterprise•Spring, TX

1d•$95,800 - $220,500•Onsite

About The Position

Hewlett Packard Enterprise is seeking an experienced Printed Circuit Board (PCB) Layout Engineer to design complex PCBs for high-performance computing systems. The engineer will work independently to lay out and help release high-speed PCBs into production. This is an onsite role, with the expectation that the employee will primarily work from an HPE office. The position involves designing PCB layouts that meet electrical performance, signal-integrity, EMI, mechanical form-factor, thermal, and manufacturing requirements. The engineer will interpret schematics, system specifications, and company design guidelines; determine design approaches and parameters; and influence decisions related to resolving system-performance issues associated with PCB layout. The role requires collaboration with electrical, mechanical, signal-integrity, and power-integrity engineers, as well as design partners across geographies. The engineer may lead these engagements, manage multiple board designs, and work independently with loosely defined parameters. HPE describes its workplace as inclusive and offers benefits supporting physical, financial, and emotional wellbeing, along with career-development programs.

Requirements

Associate degree or equivalent technical degree and 10+ years of experience laying out complex, multilayer, high-speed PCBs; alternatively, a bachelor’s degree in Electrical Engineering or equivalent technical degree and 4+ years of such experience.
Advanced knowledge of ECAD software, particularly Cadence Allegro PCB Editor.
Advanced knowledge of PCB design guidelines and design constraints.
Experience laying out boards with DDR4 or newer, PCIe Gen 4 or newer, high-speed SerDes, Ethernet, I²C, SPI, and similar interfaces.
Experience with high-speed routing techniques, such as microvias, blind and buried vias, and backdrilling.
Ability to read and interpret schematics, datasheets, and layout guidelines.
Working knowledge of electronics, including signal- and power-integrity issues.
Understanding of EMC principles and best practices for mitigating EMI.
In-depth knowledge of Design for Manufacturing (DFM) and Design for Test (DFT) principles.
Ability to work independently with loosely defined parameters and perform conceptual analysis.
Ability to work successfully with engineers across various geographies to meet design requirements and schedules.
Ability to manage multiple board designs simultaneously.
Excellent written and verbal communication skills.

Nice To Haves

Experience with liquid-cooled designs.
Experience helping define ASIC package ball maps.
Experience with industry-standard form factors, such as PCIe CEM and Open Compute Project.
Experience creating symbols and managing symbol libraries.

Responsibilities

Design PCB layouts using computer-aided design software to meet electrical performance, signal-integrity, EMI, mechanical form-factor, thermal, and manufacturing requirements.
Read and interpret schematics, system functionality and performance specifications, and company PCB design guidelines.
Determine PCB design approaches and parameters.
Influence design decisions related to analyzing and resolving system-performance issues associated with PCB layout.
Perform layout studies, determine component placement, and help drive architectural decisions.
Work with—and when necessary lead—engagements with electrical, mechanical, signal-integrity, power-integrity, and other design partners.
Work with engineers across geographies to meet design requirements and schedules.
Manage multiple board designs simultaneously.
Work with PCB fabrication shops and PCA contract manufacturers.