Principle Product Test Development Engineer

GlobalFoundriesEssex Junction, VT
$85,000 - $146,000Onsite

About The Position

This position is for a Principle Burn In Engineer located at GLOBALFOUNDRIES campus in Burlington, Vermont. The successful candidate will define, develop and debug Burn-In test software and hardware used in the process of stressing semiconductor products over temperature and voltage as part of a product qualification on advanced technology nodes on GLOBALFOUNDRIES’ strategic roadmap.

Requirements

  • Bachelor’s Degree in Circuit Design, Electrical Engineering or related technical field with more than 6 years’ experience in related area; or Master with more than 4 years’ experience.
  • Fundamental understanding of circuit design, electrical test, and the implications of electrical characteristics and performance on product behavior.
  • Good knowledge of semiconductor processing and process integration, test chips and test structures for yield limiter determination, improvement and reliability.
  • Good knowledge of Burn-In systems.
  • Perl / python scripting skills.
  • Good JTAG, SPI interface knowledge.
  • Logic (Scan, ATPG) test knowledge.
  • Good knowledge of Design for Test capabilities for Logic, Memory and Analog test.

Responsibilities

  • Own burn-in engineering activities spanning part number program development, hardware fixture design, and silicon bring-up through debug and validation.
  • Develop, optimize, and sustain Burn-In stress content used in product qualification and early-life reliability screening.
  • Own the Burn-In test strategy and working with the customer and internal teams to determine content, ensuring sufficient device coverage and throughput within defined stress limits while continuously improving equipment efficiency, data quality, manufacturing robustness, cycle time, and overall cost.
  • Perform system engineering responsibilities including burn-in system configuration and calibration control, pattern generation and implementation, PNP development, and test structure design and debug.
  • Execute burn-in programs and perform device debug analysis using digital oscilloscopes.
  • Manage projects for first-silicon bring-up, hardware vendor coordination, offshore stress coordination, part number program release and revision control, operational procedures, and comprehensive hardware and program documentation.
  • Operate in a highly cross-functional environment, collaborating with design, process integration, advanced process modules, quality, reliability, failure analysis, and customer engineering organizations to meet customer technology requirements, cost targets, and revenue goals, while providing technical leadership and peer mentoring.
  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
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