Principal System Architect

Micron Technology•San Jose, CA

1d•$202,000 - $343,000

About The Position

The Principal System Architect is a senior technical individual contributor in Micron Technology’s DRAM System and Component Architecture organization, responsible for pathfinding and defining Micron’s future DRAM product architecture. The role translates memory technology roadmaps, anticipated customer memory and storage requirements, JEDEC standards, industry ecosystem developments, and market trends into system requirements, architecture, detailed development, prototypes, validation evidence, and manufacturing release. The systems and modules may incorporate new memory technologies, high-speed digital and mixed-signal circuitry, analog functions, and power conversion. The architect leads work from concept through engineering transfer and volume manufacturing readiness. This includes defining system requirements and design trade-offs; architecting, building, characterizing, debugging, validating, and releasing complex memory module prototypes; and personally leading laboratory bring-up and risk-based verification and validation. The role also supports qualification, NPI, procurement, supplier engagement, pilot builds, yield improvement, and manufacturing transfer, while improving methods across architecture, design, simulation, prototyping, validation, and release.

Requirements

Bachelor’s degree in Electrical/Electronics Engineering or a closely related field with 15+ years of proven experience, or a master’s degree or equivalent experience with 10+ years of proven experience.
Experience architecting, developing, validating, and shipping memory, storage, compute, networking, or other high-speed electronic systems.
Deep practical experience in some system fields and working proficiency across electrical/power, mechanical, thermal, signal/power integrity, and long-term reliability.
Experience using AI.
Build effective working relationships, challenge assumptions constructively, and drive timely decisions using requirements, analysis, simulation, measured data, and documented trade-offs.

Nice To Haves

Experience in the memory and storage industry.
Experience with memory and storage subsystems, including DDR and PCIe technologies.
Ownership of at least one product or platform from requirements and architecture through prototype bring-up, qualification, and production launch.
Proficiency with relevant ECAD/MCAD and lifecycle tools such as Cadence OrCAD CIS, Allegro PCB, Allegro SI, SolidWorks, and PLM systems, or comparable toolsets.

Responsibilities

Identify and refine future customer memory needs and derive measurable system-level requirements, operating envelopes, interfaces, design margins, and acceptance criteria across electrical, mechanical, thermal, signal integrity, power integrity, and reliability domains.
Lead architecture pathfinding activities with customers and enablers.
Architect, design, bring up, characterize, debug, validate, and release complex memory module prototypes.
Own trade-offs and interface decisions from concept through engineering transfer and volume manufacturing readiness.
Lead prototype bring-up and own and supervise risk-based verification and validation plans, margin testing, qualification strategy, failure analysis, and release evidence.
Help apply FMEA, MTBF and reliability prediction, component derating, tolerance analysis, accelerated-life testing, and corrective-action methods.
Support certification, NPI, materials procurement, supplier engagement, pilot builds, test coverage, yield improvement, engineering change control, and engineering-to-manufacturing transfer.
Improve architecture, design, review, simulation, prototype, validation, and release methods to increase first-pass success, development speed, traceability, and product quality.
Technically lead multidisciplinary engineers across hardware, SI/PI, mechanical, thermal, reliability, firmware, software, ASIC, media, validation, operations, and manufacturing.