Prinicipal Signal Integrity Engineer
About The Position
As a Signal Integrity Engineer at Adaptive and Embedded Computing Group (AECG), AMD, you will be responsible for ensuring that AMD’s next-generation products deliver industry-leading reliability, performance, and efficiency. This role involves analyzing, modeling and validating the complex interconnects of high-speed Serializer/De-serializer (SerDes) channels @56/64/112/128/224+ Gbps, High speed memories like LPDDR4/5x/6, DDR5, PCIe Gen 5/6 etc., and 400/800/1600Gbps Ethernet links. You will be providing guidelines to board layout teams based on SI and Power simulations and for high-speed structures. In this role, you will closely collaborate with Board HW designers, HW architects, IC packaging team, PCB team, and external partners/suppliers to ensure first time success of the system/board products.
Requirements
- Masters or PhD degree in Electrical Engineering, Computer Engineering, or related field
Nice To Haves
- Strong experience in high-speed signal integrity engineering
- Proficiency in SI simulation tools (Keysight ADS, Cadence Sigrity, Ansys HFSS)
- Strong expertise in high-speed architecture, interconnects and PCB/package design
- Knowledge of high-speed interfaces (PCIe, Ethernet, DDR, etc.)
- Familiarity with MATLAB or Python for data analysis and automation
- Hands-on experience with lab testing tools (TDR, VNA, high-speed oscilloscopes)
- Excellent problem-solving and cross-functional collaboration skills
Responsibilities
- Model and simulate the end-to-end high-speed channels including transceivers, IC package, PCB and cross-boards connectors/cables
- Utilize industry-standard tools and methodologies to perform a variety of time/frequency domain signal integrity analysis (IBIS-AMI, SPICE, full-wave EM analysis, etc)
- Identify the link quality such as loss, reflection and crosstalk, and resolve the issues
- Conduct channel-simulations to optimize Eye Diagram, Bit Error Rate (BER) and Signal-Noise-Ratio (SNR) for high-speed signaling in a complex system.
- Interpret the simulation results to provide the design guidelines on board materials, stack-up, transmission line routings, component placement and layout optimization
- Review PCB layout and board material/stack-up, identify the potential signal integrity and power integrity issues, and propose the solutions
- Support lab validation and debugging to correlate with the simulation data
- Collaborate with cross-functional teams to drive product development while keeping projects on schedule and within scope.
Benefits
- AMD benefits at a glance.
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What This Job Offers
Job Type
Full-time
Career Level
Principal
