Intern - Signal Integrity

Micron • Boise, ID

1d

About The Position

The Signal Integrity (SI) Research & Development team enables the electrical performance of Micron's industry-leading memory and storage products, including DRAM, LPDRAM, NAND, HBM, SSDs, and emerging memory technologies. The team works across silicon, package, PCB, and system-level designs to develop high-speed signaling and power delivery solutions that support next-generation computing, AI, networking, automotive, mobile, and data center applications. As a Signal Integrity Engineer, you will support the design, analysis, and validation of high-speed memory interfaces and power distribution networks across Micron's product portfolio. Working alongside experienced engineers, you will use modeling, simulation, measurements, and AI-enabled workflows to evaluate signal and power integrity performance, support product development, and contribute to future technology and industry standards initiatives.

Requirements

• 0-2 years of relevant experience through internships, research, academic projects, laboratory work, or industry experience in signal integrity, power integrity, high-speed design, electrical engineering, or related technical fields.
• Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Physics, or a related technical field.
• Knowledge of signal integrity, power integrity, transmission lines, high-speed interfaces, PCB design, or electromagnetic fundamentals.
• Experience with electrical simulation, modeling, laboratory measurement techniques, or engineering analysis tools gained through coursework, research, or projects.
• Strong analytical, fixing, and problem-solving skills.
• Experience with programming, scripting, or automation using Python, MATLAB, or similar tools.
• Strong written and verbal communication skills with the ability to work effectively in multi-functional teams.
• Demonstrated ability to apply AI-enabled tools and agentic workflows to improve productivity, data analysis, technical evaluations, and engineering communication.

Nice To Haves

• Experience with signal integrity, power integrity, high-speed SerDes, memory interfaces, or package and PCB design through internships, research, or academic projects.
• Familiarity with industry-standard SI/PI simulation and modeling tools.
• Knowledge of DRAM, LPDDR, HBM, NAND, SSD, or other memory technologies.
• Experience developing automation solutions, data analysis workflows, or engineering productivity tools using Python or similar programming languages.
• Experience using AI assistants, large language models (LLMs), or AI-enabled engineering workflows such as Copilot, Claude, GPT, Gemini, or agentic automation platforms.
• Familiarity with industry standards such as JEDEC, ONFI, IBIS, or related interface specifications.
• Demonstrated ability to work independently while collaborating effectively in a fast-paced engineering environment.

Responsibilities

• Support signal integrity and power integrity analysis for high-speed memory interfaces and power distribution networks through modeling, simulation, measurement, and correlation activities.
• Collaborate with silicon, package, product, validation, and system engineering teams to ensure product electrical performance across all stages of development.
• Develop and evaluate die, package, PCB, and system-level models to identify performance risks and optimization opportunities.
• Apply AI-enabled tools and agentic workflows to improve engineering efficiency, automate analysis, improve reporting, and support technical problem-solving.
• Contribute to methodology development, standards exploration, customer support activities, and documentation of technical findings and recommendations.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Intern