Principal/Senior Principal Electromechanical Design Engineer

Northrop Grumman•Baltimore, MD

2d•$108,800 - $203,600•Onsite

About The Position

Northrop Grumman Mission Systems is seeking a Principal/Senior Principal Electromechanical Design Engineer to join their team. This position will be located in Linthicum, Maryland and will require 100% on-site work. The role involves designing, prototyping, and providing production support for state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies. The engineer will collaborate within a cross-functional Integrated Product Team (IPT), communicating effectively with peers in adjacent functions such as electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management, and manufacturing. Responsibilities also include organizing and prioritizing tasks to meet project milestones within schedule and budget, and providing technical leadership and mentoring to less experienced personnel. This position may be filled as either a Principal or Senior Principal Electromechanical Design Engineer and is contingent upon contract award and the ability to obtain an active US Government Secret Clearance or the successful transfer of an active US Government Secret Clearance prior to start.

Requirements

U.S Citizenship is required.
The ability to obtain/maintain a US Government Secret clearance.
A current/active clearance is not required to be considered for the position, but a final clearance is required to start
Minimum 5 years of professional experience in PWB/CCA design and signal routing, including substrate/PWB layout and chip-scale packaging technologies.
Minimum 5 years of experience applying materials, specifications, manufacturing processes, and design tools used for multi-chip modules, PWBs, and CCAs.
Minimum 5 years of hands-on experience using AutoCAD, Xpedition, or both for design and layout work.
Minimum 5 years of experience using NX or comparable 3D modeling software in an engineering or design environment.
Bachelor’s degree with 5 years of experience, a master’s degree with 3 years of experience or a PhD with 1 year of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement (for Principal level)
Minimum 8 years of professional experience in PWB/CCA design and signal routing, including substrate/PWB layout and chip-scale packaging technologies.
Minimum 8 years of experience applying materials, specifications, manufacturing processes, and design tools used for multi-chip modules, PWBs, and CCAs.
Minimum 8 years of hands-on experience using AutoCAD, Xpedition, or both for design and layout work.
Minimum 8 years of experience using NX or comparable 3D modeling software in an engineering or design environment.
Bachelor’s degree with 8 years of experience, a master’s degree with 6 years of experience or a PhD with 4 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement (for Senior Principal level)
The ability to obtain/maintain a DoD Active Secret clearance.

Nice To Haves

Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
A current/active US Government Secret Clearance or higher
Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
Familiarity with thermal and structural analysis considerations, methodologies, and software tools
Experience with hands-on assembly and testing of prototype electronic hardware
Experience in a technical leadership role on a cross-functional product development team
Experience routing RF signals

Responsibilities

Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
Organizing and prioritizing tasks to accomplish project milestones within schedule and budgetary constraints.
Providing technical leadership and mentoring to less experienced personnel.