ASML US, LP brings together the most creative minds in science and technology to develop lithography machines that are key to producing faster, cheaper, more energy-efficient microchips. We design, develop, integrate, market and service these advanced machines, which enable our customers - the world’s leading chipmakers - to reduce the size and increase the functionality of their microchips, which in turn leads to smaller, more powerful consumer electronics. We have an exciting opportunity for an experienced Principal Scientist - Tin Management Architect to join the Source Research department in San Diego and lead the definition and evolution of the next-generation Tin Management architecture for future lithography light sources. ASML's leadership in lithography depends on continued innovation in source technology. A key challenge for future EUV systems is the management of tin debris generated during the laser-produced plasma (LPP) process. Effective Tin Management is critical to protecting source hardware, maintaining optical performance, enabling higher source power, and reducing cost of technology. As the Tin Management Architect, you will define the long-term technology roadmap and system architecture required to address these challenges. Working across research, modeling, and product development teams, you will evaluate architectural trade-offs, identify key technology gaps, guide research investments, and shape future source concepts. The ideal candidate combines deep technical expertise with strong systems thinking and the ability to operate effectively in a multidisciplinary environment. Success in this role requires balancing physics, engineering, modeling, manufacturability, and cost considerations to drive architectural decisions at the fuzzy front end of product development.
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Job Type
Full-time
Career Level
Principal
Education Level
Ph.D. or professional degree