Principal Process Engineer Job#5277

TSMC•USA-Arizona, AZ

9d•Onsite

About The Position

TSMC Arizona Corporation is hiring multiple Principal Process Engineers to work at its Phoenix, Arizona semiconductor fab. The role works with device, integration, defect reduction, lithography, etch, and thin films teams to develop, control, and improve leading-edge integrated modules, resolve issues, and respond to customer requests. The engineer leads experiment design and execution, interprets complex data, and uses results to optimize manufacturing processes and achieve precise control at atomic levels. The position applies statistical process control to establish and sustain robust manufacturing processes; supervises manufacturing equipment installation and maintenance to expand capacity with quality; and collaborates with equipment and material suppliers and partners to identify technology gaps and deficiencies, then devise, evaluate, and qualify mitigation and continuous-improvement solutions. Candidates must be able to work on-site at the Phoenix facility. Standard hours are 40 hours per week, Monday through Friday, 8:30 a.m. to 5:30 p.m.

Requirements

Master’s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science, or a related field, and 3 years of engineering experience; alternatively, a bachelor’s degree in one of those fields or a related field and 5 years of progressive, post-baccalaureate engineering experience.
At least 2 years of semiconductor process engineering experience.
At least 2 years of experience in at least 2 of the following: design of experiments (DOE), statistical process control, or statistical methods for modeling multivariate data sets.
At least 2 years of experience with at least 2 of the following semiconductor-processing metrology methods: TEM, SEM, CD-SEM, EDS, FIB, AFM, XRD, emission spectroscopy, Raman spectroscopy, spectroscopic ellipsometry, Quartz PCI, or FT-IR.
At least 2 years of experience in at least 3 of the following: wafer cross-section techniques, wafer fabrication processes, ion transport phenomena, DRAM, plasma etching, plasma simulation, semiconductor thin-film deposition, ALD, 3D NAND Flash, CVD, or PECVD.
At least 1 year of experience leading projects and providing career and performance feedback to junior engineers and technicians.
Must be willing and able to work on-site at the Phoenix, Arizona facility.

Responsibilities

Apply statistical process control methods to establish and sustain a robust manufacturing process.
Supervise the installation and maintenance of manufacturing equipment to expand capacity while maintaining quality.
Collaborate with equipment and material suppliers and partners to identify technology gaps and deficiencies.
Devise, evaluate, and qualify mitigation and continuous-improvement solutions.
Work with device, integration, defect reduction, lithography, etch, and thin films teams on integrated module development, control, and improvements.
Resolve issues and address specific customer requests.
Lead the design and execution of experiments and interpret complex data to optimize manufacturing processes.