Principal Process Engineer Job#5277

TSMC•Phoenix, AZ

10d•Onsite

About The Position

TSMC Arizona offers the opportunity to work at an advanced semiconductor fab in the United States. The first fab will operate N4 process technology, with production scheduled to start in the first half of 2025. The second fab will use N3 and N2 technology and is expected to be operational in 2028. A third fab is planned to manufacture chips using 2nm or more advanced technology, with production starting by the end of the decade. The Principal Process Engineer works with device, integration, defect reduction, lithography, etch, and thin films teams to develop, control, and improve leading-edge integrated modules and address issues or customer requests. The role leads experiment design and execution, interprets complex data, and optimizes manufacturing processes for precision control at atomic levels. Multiple positions are available.

Requirements

A master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science, or a related field, and 3 years of engineering experience; alternatively, a bachelor's degree in one of these fields and 5 years of progressive post-baccalaureate engineering experience.
At least 2 years of semiconductor process engineering experience.
At least 2 years of experience in at least two of the following: Design of Experiment (DOE), statistical process control, or statistical methods for modeling multivariate data sets.
At least 2 years of experience with at least two of the following semiconductor-processing metrology methods: TEM, SEM, CD-SEM, EDS, FIB, AFM, XRD, Emission Spectroscopy, Raman Spectroscopy, Spectroscopic Ellipsometry, Quartz PCI, or FT-IR.
At least 2 years of experience in at least three of the following: wafer cross-section techniques, wafer fabrication processes, ion transport phenomena, DRAM, plasma etching, plasma simulation, semiconductor thin-film deposition, ALD, 3D NAND Flash, CVD, or PECVD.
At least 1 year of experience leading projects and providing career and performance feedback to junior engineers and technicians.
Must be willing and able to work on-site at the Phoenix, Arizona facility.

Responsibilities

Apply statistical process control methods to establish and sustain robust manufacturing processes.
Supervise installation and maintenance of manufacturing equipment to expand capacity while maintaining quality.
Collaborate with equipment and material suppliers and partners to identify technology gaps and deficiencies, and develop, evaluate, and qualify mitigation and continuous-improvement solutions.
Work with device, integration, defect reduction, lithography, etch, and thin films teams on integrated module development, control, and improvement.
Lead the design and execution of experiments and interpret complex data to optimize manufacturing processes.