Careers that change lives start here. Medtronic is a global leader in healthcare technology with a Mission to alleviate pain, restore health, and extend life. Our 95,000 employees work across more than 150 countries to put patients first — developing innovative medical technologies that improve the lives of 72+ million patients each year. Your unique talents will help shape the future of healthcare while building a career grounded in purpose, growth, and impact. A Day in the Life At Medtronic, we bring bold ideas forward with speed and decisiveness to put patients first in everything we do. In-person exchanges are invaluable to our work. We’re working onsite 4 days a week as part of our commitment to fostering a culture of professional growth and cross-functional collaboration as we work together to engineer the extraordinary. Die Prep / Printed Circuit Board Assembly The Principal Process Engineer is responsible for developing and transferring highly stable, cost-effective, and scalable microelectronic packaging (Printed Circuit Board Assembly and Wafer Level Packaging) processes into manufacturing. You will develop and support equipment and processes such as underfill dispense, pick and place, solder paste dispense, reflow, epoxy cure, clean, laser cutting, automated inspections, etc. This entails output monitoring, performing necessary experiments to establish robust processes and gaining a thorough understanding of capabilities and interactions with upstream and downstream processes including metrology needs. You will provide inputs to design teams and advance the state of the art in microelectronic assembly.
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Job Type
Full-time
Career Level
Principal