The Principal Process Engineer is responsible for developing and transferring highly stable, cost-effective, and scalable microelectronic packaging (Printed Circuit Board Assembly and Wafer Level Packaging) processes into manufacturing. You will develop and support equipment and processes such as underfill dispense, pick and place, solder paste dispense, reflow, epoxy cure, clean, laser cutting, automated inspections, etc. This entails output monitoring, performing necessary experiments to establish robust processes and gaining a thorough understanding of capabilities and interactions with upstream and downstream processes including metrology needs. You will provide inputs to design teams and advance the state of the art in microelectronic assembly.
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Job Type
Full-time
Career Level
Principal