About The Position

We are seeking an experienced Digital Designer for SoC Implementation / Physical Design for advanced semiconductor products. This role will own end-to-end physical design execution across complex designs, driving delivery from RTL to silicon for cutting-edge technology nodes. The ideal candidate demonstrates deep technical expertise to implement a given design on silicon with optimized quality and meeting PPA targets.

Requirements

  • Full RTL-to-GDSII implementation flow (Cadence and/or Synopsys tool sets)
  • Floorplanning, synthesis, PNR, CTS, routing
  • STA and signoff methodologies
  • Physical verification (DRC/LVS/ERC)
  • Advanced node implementation (≤ 16nm / 5nm)
  • Low power design (UPF/CLP)
  • Scripting in Python, TCL, and Perl
  • Bachelor’s or Master’s in Electrical / Electronics Engineering or related field
  • 10+ years of experience in ASIC / SoC physical design
  • Strong knowledge of industry EDA tools (Synopsys, Cadence flows)
  • Strong communication skills

Nice To Haves

  • Experience in high-reliability SoCs
  • Exposure to AI-driven design methodologies and automation

Responsibilities

  • Lead Physical design execution including floorplanning, synthesis, place & route, CTS, routing, STA, PDN, PDV and signoff.
  • Drive timing, power, IR/EM, and physical verification closure to achieve tapeout readiness.
  • Deliver optimized PPA (Power, Performance, Area) across complex designs.
  • Aligns with internal expectations of implementing designs on silicon with optimal quality, PPA, and cost efficiency.
  • Participate in mentoring and career development.
  • Role-Model execution discipline, review mechanisms, and performance tracking.
  • Interface with senior leadership for status reporting, escalation, and decision-making.
  • Define and deploy next-generation physical design methodologies.
  • Drive automation, flow optimization, and tool innovation.
  • Lead adoption of advanced node technologies (5nm and beyond).
  • Improve scalability, productivity, and design quality through methodology enhancements.
  • Collaborate with architecture, RTL, verification, and product teams to ensure design convergence.
  • Interface with EDA vendors and IP providers for tool and flow optimization.
  • Support post-silicon bring-up, yield improvement, and production ramp activities.
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