Principal Photonics Integration Engineer

Micron Technology • Boise, ID

4d

About The Position

The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap.
As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making.

Requirements

• A PhD in Electrical Engineering, Materials Science, Physics, Photonics, Semiconductor Engineering, or a related field, or equivalent experience, is required along with over 3 years of applicable industry experience. Alternatively, a Master's degree or comparable experience with more than 5 years of relevant industry background is acceptable. Candidates holding a Bachelor's degree or equivalent experience and upwards of 7 years in the industry will also be considered.
• Experience integrating silicon photonics processes in semiconductor development or manufacturing environments
• Strong knowledge of semiconductor process integration, wafer fabrication, process characterization, DOE methodology, and statistical analysis
• Experience with process flow architecture, device integration, design rule development, and tape out execution
• Demonstrated success leading multi-functional technical projects and using data-driven approaches to solve sophisticated engineering challenges

Nice To Haves

• Experience with silicon photonics, III-V semiconductor technologies, and heterogeneous integration platforms
• Experience with advanced packaging technologies including hybrid bonding, wafer bonding, optical interposers, co-packaged optics, and optical packaging
• Knowledge of optical interconnect technologies for datacenter, networking, AI accelerator, HPC, or memory applications
• Experience applying AI, machine learning, advanced analytics, or workflow automation to engineering and manufacturing challenges
• Strong communication, program leadership, and project management skills with the ability to influence technical and business collaborators across organizations

Responsibilities

• Develop and optimize end-to-end process integration flows for silicon photonics technologies from concept through manufacturing readiness
• Lead integration and process development for photonic devices, optical interconnects, advanced packaging solutions, and heterogeneous integration architectures
• Drive process characterization, DOE execution, yield improvement, defect reduction, root cause investigations, and process optimization activities
• Partner with design, device, packaging, manufacturing, and supplier teams to support design rule development, tapeouts, and technology transfers
• Lead technical programs, technology roadmaps, and AI-enabled engineering initiatives that improve development efficiency and product performance

Benefits

• choice of medical, dental and vision plans
• benefit programs that help protect your income if you are unable to work due to illness or injury
• paid family leave
• robust paid time-off program
• paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Education Level: Ph.D. or professional degree