Principal Engineer, Silicon Photonics Assembly

Marvell Technology•Westlake Village, CA

2d•$168,400 - $249,310

About The Position

The Advanced Packaging Technology Development team develops packaging and assembly technologies for Marvell's next-generation silicon photonics and co-packaged optics (CPO) products. The team works closely with product teams, suppliers, and OSAT partners to develop and qualify advanced assembly solutions for complex photonic and semiconductor products.

Requirements

M.S. or Ph.D. in Materials Science, Packaging Engineering, Mechanical Engineering, Manufacturing Engineering, or a related field.
10+ years of experience in advanced packaging, semiconductor assembly, or technology development.
Proven track record developing and qualifying advanced package assembly technologies for complex semiconductor products.
Strong expertise in assembly process development, package integration, and design for manufacturability.
Experience collaborating with OSATs, equipment suppliers, and cross-functional engineering teams.

Nice To Haves

Optical module integration and co-packaged optics (CPO) experience is preferred.

Responsibilities

Develop and qualify assembly technologies for silicon photonics and co-packaged optics (CPO) products, including optical engine and connector attach processes.
Lead process development, characterization, and design of experiments (DOE) to establish assembly capabilities and process windows.
Collaborate with OSATs, equipment suppliers, and material vendors to evaluate new assembly processes, materials, and equipment.
Drive root-cause analysis and resolution of assembly and reliability challenges.
Provide technical leadership from early technology evaluation through prototype build and product qualification.