Participate in the characterization and development of packaging materials and processes tailored for high-speed optical communication. This role is part of Credo’s optical communications team and focuses on enabling manufacturable, reliable, and scalable packaging solutions for next-generation optical devices. Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect products deliver industry-leading power and performance at up to 1.6T to meet the ever-expanding data infrastructure demands of AI. Our product portfolio includes ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers, OmniConnect memory solutions, and a suite of retimers and DSPs for optical and copper Ethernet and PCIe, all leveraging the PILOT diagnostic and analytics software platform. Credo innovations enable our customers to connect the systems that connect the world. Credo is committed to creating an inclusive environment for all employees and welcome applicants from diverse backgrounds without regard to race, color, religion, gender, sex, sexual orientation, national origin, genetic information, age, disability, veteran status, or any other legally protected basis. If you have a disability or special need that requires accommodation to navigate our website or complete the application process, email [email protected] [[email protected]].
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Job Type
Full-time
Career Level
Principal