Principal Mechanical Engineer

Hewlett Packard Enterprise•Sunnyvale, CA
•Onsite

About The Position

The Principal Mechanical Engineer is a hands-on individual contributor responsible for mechanical design, structural analysis, development, and qualification of complex networking systems from concept through production. Reporting to the Head of Mechanical Engineering, this role works independently on challenging engineering problems and collaborates with cross-functional teams in a fast-paced product development environment. The position focuses on mechanical design fundamentals and structural analysis, including finite element analysis (FEA), shock and vibration, and simulation-to-test correlation. The engineer supports mechanical design and structural analysis across product development programs, including chassis design, system packaging, reliability, and manufacturability. The role includes prototype evaluation, laboratory testing, root-cause investigations, design improvements, and hands-on use of CAD, tolerance analysis, and testing. The position also provides technical guidance, project scoping and resource estimates, and contributes to mechanical specifications, design guidelines, validation plans, and engineering best practices. This is an onsite role, with an expectation that the employee will primarily work from an HPE office. The listed annual base salary range in California is USD 140,500–285,000; variable incentives may also be offered. Actual compensation may vary based on location, work experience, education or training, and skill level.

Requirements

  • At least 10 years of experience in electromechanical product development.
  • Master’s degree in Mechanical Engineering, Applied Physics, or equivalent.
  • Experience developing networking, server, storage, telecommunications, or high-performance computing systems.
  • Extensive experience with chassis development, system packaging, and high-density electronic assemblies.
  • Experience with FEA and familiarity with ANSYS Workbench, including static-structural, modal analysis, transient mode superposition, Eigenvalue-Buckling, and steady-state thermal analysis.
  • Strong hands-on experience with tolerance analysis, GD&T, stack-up analysis, and structural analysis techniques.
  • Expert-level proficiency with 3D solid modeling tools.
  • Experience meshing sheet-metal geometries as solid or shell elements and simplifying meshes by defeaturing non-structural elements.
  • Strong structural intuition regarding load paths in mechanical designs.
  • Ability to break complex system designs into subsystems to simplify FEA setup and runtime.
  • Familiarity with test standards including GR-63, IPC-9704, and ASTM D4169.
  • Strong working knowledge of Young’s modulus and coefficients of thermal expansion of common materials used in ASIC and cooling components.
  • Hands-on experience in dynamic testing.
  • Experience developing complex chassis and system-level mechanical designs for networking, server, storage, or telecommunications products.
  • Experience with ECAD-MCAD integration and IDF workflows.
  • Understanding of sheet-metal design, machining, castings, extrusions, plastics, and associated manufacturing processes.
  • Understanding of tooling requirements and manufacturing considerations for volume production.
  • Understanding of NEBS, EMI, EMC, safety, and other regulatory compliance requirements.
  • Ability to troubleshoot complex system-level mechanical issues in laboratory, manufacturing, and field environments.
  • Experience leading root-cause investigations and implementing corrective actions.
  • Strong communication and leadership skills, including the ability to influence cross-functional teams.
  • Comprehensive understanding of the product development lifecycle from concept through production and field support.

Nice To Haves

  • SolidWorks experience.
  • Working knowledge of EPDM or an equivalent PLM system.
  • Experience with LS-Dyna and response spectrum analysis.
  • Experience modeling die warpage due to thermal effects and heatsink loading.
  • Prior training in PCB strain-gauge applications and data analysis involving principal microstrain and strain rate.
  • Experience filtering and analyzing accelerometer G-value data from dynamic tests such as vibration and shock.
  • Knowledge of dye-and-pry and Shadowmoire techniques, and operation of 3D-scanning metrology equipment.

Responsibilities

  • Develop and own structural FEA simulation capabilities for new product introduction (NPI) projects and sustaining issues.
  • Improve simulation accuracy through test correlation and model refinement.
  • Maintain and coordinate multiple FEA projects, including work performed by internal functions and external partners.
  • Drive and review FEA simulation work by component suppliers and original design manufacturers (ODMs).
  • Provide design guidance from the concept phase by running FEA studies on areas of concern.
  • Serve as the main point of contact for mechanical issues arising from MDVT and HALT, and lead issue resolution by validating design changes through simulation and/or testing.
  • Design and prototype chassis and fixtures for testing.
  • Develop in-house expertise in strain-gauge applications and accelerometer measurements during MDVT and HALT.
  • Process and analyze test data, including microstrain, G-levels, and ASIC temperatures, throughout MDVT and HALT.
  • Document testing and FEA simulations, including static loading, modal analysis, and dynamic analysis, in NPI project design reviews; take responsibility for system structural integrity.
  • Communicate recommended design changes to hardware leads with supporting justification based on FEA results.
  • Collaborate with the ASIC development team to generate 3D ASIC models from package outline drawings, including BGAs, and conduct near-package or co-package connector placement and floorplan studies as needed.
  • Support manufacturing and operations efforts to improve production yield through FEA studies or limited laboratory design-of-experiments work.
  • Provide mechanical design and structural analysis support across product development programs, including chassis design, packaging, reliability, and manufacturability.
  • Perform hands-on engineering activities, including CAD design and reviews, tolerance analysis, prototyping, testing, and root-cause investigations.
  • Collaborate with cross-functional teams and suppliers to identify technical risks, resolve design and manufacturing issues, and implement corrective actions.
  • Contribute to mechanical specifications, design guidelines, validation plans, and engineering best practices.
  • Provide project scoping, resource estimates, schedule input, and technical guidance for new product development efforts.

Benefits

  • Comprehensive benefits supporting physical, financial, and emotional wellbeing.
  • Career development programs supporting professional growth and career goals.
© 2026 Teal Labs, Inc
Privacy PolicyTerms of Service