TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency (“RF”) components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards (“PCB”s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market. Expertise in design and electronic packaging experience with military and commercial equipment required. Experienced with materials and process involved in electronic packaging, as well as design experience for ground, shipborne, airborne, and space applications. Possess advanced skills in some aspects of electronic packaging (i.e. Thermal Analysis, Structural Analysis, Environmental, etc.). Broad Function: Responsible in leading of assigned product design teams to perform mechanical engineering functions in the design and development of both current and the next generation of military and space-based products with the responsibility for meeting customer requirements and company internal requirements for mechanical design and integrity of the equipment. Provide technical leadership and guidance to the Mechanical Engineering and Design functions through the evaluation and introduction of new design and analysis capabilities. Assist with or lead technical proposal efforts and provide Mechanical Engineering support to the team. Support Technology Roadmap developments.
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Job Type
Full-time
Career Level
Principal