Principal Mechanical Design Engineer

Qorvo • Richardson, TX

2d

About The Position

Qorvo is looking for an experienced Principal Mechanical/Thermal Engineer to join the Defense & Aerospace product development team. The successful candidate will lead mechanical design and analysis efforts of electronics packaging for defense communications, radar and electronic warfare applications.

Requirements

• BSME/MSME degree in mechanical engineering or other relevant field with a minimum of 12 years’ experience in semiconductor packaging.
• Experience in the design of packaged microelectronic assemblies for the defense, avionics, aerospace, or automotive industries.
• Expert level skill with ANSYS and Solidworks, or similar.
• Expert knowledge of legacy and advanced microelectronic package technologies for commercial, defense, and aerospace markets including materials, manufacturing methods, plating, sealing, and interconnect technologies.
• Experience with microelectronic package assembly processes including die attach, wire bond, flip chip, epoxy dispense, encapsulation, and solder reflow.
• Knowledge of microelectronic inspection tools and equipment including capabilities and limitations.
• Knowledge of failure analysis techniques and equipment.
• Knowledge of reliability calculation methods for semiconductors.
• Understanding of GD&T, ANSI standards and tolerance stack-ups required.
• Demonstrated ability to work with cross-functional teams.
• Excellent verbal communication and interpersonal skills.
• Excellent written communications skills.
• Must be a US Person (US citizen, permanent resident, asylee or refugee) due to work on US Government contracts.
• This position is not eligible for visa sponsorship by the Company.

Responsibilities

• Develop next generation microelectronic packaging technology with emphasis on structural analysis.
• Work closely with a select team of IC designers, module designers, process engineers, and CAD tool set specialists to develop products and development tools to move state-of-the-art packaging technology forward.
• Perform detailed modeling and optimization of packaging design at the die/package/board level using FEA and other industry-standard simulation tools.
• Develop and execute thermal and mechanical stress measurement techniques to support analysis for internal and external customers.
• Guide package and substrate design decisions that meet performance specifications and yield requirements.
• Supervise and respond to manufacturing issues as they occur.
• Maintain an overview of packaging technology trends across GaN, GaAs, Digital Si, and Analog Si, and provide inputs to implement these technology trends.
• Support external customers with applications models and failure analysis support.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal