Principal HBM Design Architect

Micron Technology • Richardson, TX

3d

About The Position

Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
For more than 43 years, Micron Technology has developed world‑leading memory and semiconductor solutions. As an HBM Memory Design Engineer on the HBM Architecture Team, you will craft, simulate, optimize, and floorplan digital and analog DRAM circuits used in advanced HBM products. You will evaluate block‑level and full‑chip functionality, propose solutions to ensure functionally accurate design, and work within a highly innovative team developing next‑generation high‑bandwidth memory. Micron’s HBM DEG integrates front‑end and backend technologies, TSV‑based 3D stacking, custom gate‑level and mixed-signal circuits, and large‑scale verification to deliver low‑power, high‑performance solutions for ML and AI applications. This role provides the opportunity to grow within a diverse, collaborative, distributed team while contributing to the development of sophisticated HBM products.

Requirements

• BSEE with 7+ years, or MSEE with 5+ years of relevant engineering experience
• Extensive knowledge of CMOS circuit design and device physics
• Experience with schematic entry and simulation using FineSim, HSPICE, or equivalent tools
• Experience with power network analysis
• Proficiency with scripting languages such as Python, Tcl, or Perl

Nice To Haves

• Familiarity with memory design
• Strong analytical and problem‑solving skills
• Effective communication skills and an innovative mindset open to improving processes and products

Responsibilities

• Design, simulate, and optimize DRAM memory array, data path, ECC, command/control, and high‑speed interface circuits
• Evaluate block‑level and full‑chip functionality and propose solutions to ensure functional correctness
• Analyze timing, area, power, and complexity trade‑offs in high‑speed DRAM or mixed‑signal circuits
• Perform pathfinding and feasibility studies to explore new architectures for future HBM products
• Contribute to the design, layout, and optimization of memory, logic, and analog circuits
• Support verification, debug, and validation activities for large‑scale HBM designs
• Work collaboratively across engineering teams involved in vertical integration and TSV‑based stacking
• Participate in design reviews and continuous improvement of design methodologies

Benefits

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal