Principal Hardware Product Engineer

Draper•Cambridge, MA

1d•$95,000 - $245,000•Onsite

About The Position

Join Draper’s multidisciplinary engineering team as a Design for Manufacturing and Assembly (DFX) Engineer, where your expertise in device packaging techniques for conventional over-molded electronic parts, multi-chip modules, open / closed MEMs devices and sealed ceramic packages will directly contribute to the success of mission-critical systems in aerospace, defense, and beyond. In this role, you’ll work closely with layout and design engineers, supply chain, and internal manufacturing teams to apply DFM/DFA best practices early in the product development cycle, ensuring a smooth transition from design to production. You’ll review packaging layouts and designs for manufacturability, lead design reviews, and deliver actionable feedback that drives product integrity and performance. As a Principal Engineer, you’ll engage with internal service centers and external contract manufacturers to resolve assembly, and workmanship challenges. You’ll also collaborate with Mission Assurance to support quality investigations and continuous improvement initiatives. We’re looking for an engineer with hands-on experience in microelectronics packaging for high-reliability or aerospace applications, someone who understands the nuances of material selection, MIL-STD-883, MIL-PRF-38534 and MIL-PRF-38535. Familiarity with AS9100 environments and a passion for cross-functional problem-solving are key to success in this role.

Requirements

Hands-on experience in microelectronics packaging for high-reliability or aerospace applications
Understanding of material selection, MIL-STD-883, MIL-PRF-38534 and MIL-PRF-38535
Familiarity with AS9100 environments
Passion for cross-functional problem-solving
Curiosity-driven approach to solving complex, customer-driven problems as part of a multi-disciplinary team.
Collaborate and communicate effectively and openly with multi-disciplinary program team members, program leadership, and non-technical personnel.
Be a team player able to work in a fast-paced environment with the ability to balance multiple competing tasks and demands.
10-15 years experience in Product Engineering or related.

Nice To Haves

Expertise in device packaging techniques for conventional over-molded electronic parts, multi-chip modules, open / closed MEMs devices and sealed ceramic packages

Responsibilities

Use Computer Aided Design (CAD) programs to create product concepts.
Gather materials or resources needed to design the product.
Test the product for usability and safety.
Oversee the manufacturing and production process to set standards.
Independently drive solutions to complex problems - develop requirements, propose ways forward when customer requirements are unclear or incomplete, and adapt appropriately to changes in requirements.
Act as a Subject Matter Expert (SME) in Product Engineering.
Provide insight and suggest design or process modifications based on quantitative data or results.
Identify program/system-level technical risks and develop and execute mitigation strategies.
Develop, document, and teach best practices to less experienced engineers; Demonstrate strong organization, planning, and time management skills to achieve program goals.