Principal Equipment Engineer (Multiple Positions) #1599

TSMC•USA-Arizona, AZ

1d•Onsite

About The Position

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future. As a Principal Equipment Engineer, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation, and Customer Trust. Multiple positions available.

Requirements

Bachelor’s degree or foreign equivalent in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field, plus 5 years of experience in an engineering role. Company will also accept two (2) years of additional experience in lieu of a Bachelor’s degree.
3 years of experience with Semiconductor manufacturing principles, practices and techniques as they relate to equipment engineering and maintenance.
3 years of experience with at least one of the following software: Creo 3D CAD, Pro-E, AutoCAD, MATLAB, COMSOL, Solidworks.
3 years of experience with Planning/scheduling within a manufacturing environment for tool install construction projects.
3 years of experience with at least one of the following: mechanical systems knowledge with a focus on semiconductor lithography track equipment robotics, pneumatics, or electrical systems; physics and chemistry principles as they apply to semiconductor lithography processes; or troubleshooting complex defect and hardware issues to resolve root cause issues.
3 years of experience overseeing junior engineers.
Willing and able to work on-site at our Phoenix Arizona facility.

Responsibilities

Retrofit component and parameters settings to improve tool performance and availability for diffusion, thin film, lithography or etching equipment in a clean room environment.
Install and qualify new tool sets according to planned schedules, to add capacity in a timely manner.
Solve critical equipment issues, improving tool uptime availability and utilization efficiency.
Implement best known methods in hardware to control tools performance and utilization.
Identify and pursue opportunities for hardware capability enhancement, driving defect reduction.
Communicate with cross-function engineers or vendors, and serve as a module liaison with facilities, vendor, and manufacturing shift personnel.