Principal Engineer- Advanced Packaging TD

Marvell Technology•Chandler, AZ

21h

About The Position

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Requirements

Deep expertise in advanced packaging technologies, including: 2.5D/3D integration, chiplets, interposers, and advanced substrates
Materials, process integration, and manufacturability
Reliability (component and board level), warpage, and thermal management
Strong foundation in electrical engineering: Signal integrity (SI), power integrity (PI), and electromagnetic behavior
Experience with high-speed interfaces and complex PDNs
Proven experience in technology development and productization, not just design or research
Bachelor’s degree with 10+ years of experience, or Master’s / PhD with 8+ years of experience in relevant fields

Responsibilities

Develop and mature advanced packaging technologies from concept to production-ready solutions.
Drive integration of new technologies into product platforms, ensuring alignment with system requirements and manufacturing constraints.
Define and implement package architectures including chiplet topology, interconnect strategy, interposer/substrate design, and power delivery networks.
Lead co-design across silicon, package, and system to optimize performance, power, and area.
Establish and refine design rules, stack-ups, and integration guidelines for advanced packaging technologies.
Drive scaling of interconnect density, substrate capability, and PDN performance.
Work closely with OSATs, foundries, and substrate suppliers to ensure process capability, yield, and cost targets are met.
Drive resolution of manufacturability challenges and ensure smooth ramp to HVM.
Lead development of test vehicles and engineering builds to validate technology readiness.
Drive package qualification, reliability validation, and failure analysis.
Lead cross-functional efforts across design, product engineering, and supply chain to ensure successful technology deployment.
Influence supplier roadmaps to align with product and technology needs.