Plating Manufacturing Technician (52907)

Headway Technologies•Milpitas, CA

11d•Onsite

About The Position

The Plating ME Technician supports manufacturing and engineering teams in the plating area and assists wafer fab production. The role reviews and documents processes and procedures, dispositions abnormal wafers for rework, and maintains process controls using Statistical Process Control (SPC). It also involves collecting and analyzing data, recommending corrective action, troubleshooting equipment and processes, and supporting manufacturing-efficiency improvements. The position is located in Milpitas, California, and reports to the Senior Manager, Plating Manufacturing Engineering. This full-time position works D shift: Friday through Sunday and every other Thursday, 6:00 PM to 6:00 AM. The schedule may change to meet business or operational needs, and overtime may be required based on business needs. Work is primarily indoors in a Class 100 ESD-sensitive wafer manufacturing facility. The technician wears cleanroom attire and may travel between buildings. The work environment may involve hazardous conditions, chemicals, fumes, gases, or loud noise, as well as standing, walking, bending, twisting, fine grasping, computer and office-equipment use, and occasional pushing, pulling, or lifting of up to 30 pounds.

Requirements

Associate degree in Electronics, Industrial Engineering, or Manufacturing Technology, and/or equivalent relevant experience.
Two years of experience working in the semiconductor industry in a high-volume manufacturing environment.
Strong knowledge of electronics and manufacturing processes.
Proficiency with Microsoft Office applications, including Word, Excel, PowerPoint, and Access.
Knowledge of and ability to use plating tools or wet etch equipment.
Knowledge of semiconductor and hard disk drive industry principles, practices, and techniques.
Knowledge of and ability to use SPC to maintain process controls.
Ability to collect and analyze data using SPC, present findings, and recommend corrective action.
Ability to troubleshoot tools and tool sets to minimize downtime.
Ability to adhere to safety policies and procedures.
Ability to communicate verbally and in writing with contractors, consultants, employees, management, and vendors.
Demonstrated problem-solving ability.
Time-management skills.
Ability to resolve issues quickly and efficiently.
Flexibility and ability to prioritize.

Responsibilities

Support manufacturing and engineering teams in the plating area.
Support wafer fab production and manufacturing processes to ensure wafers are processed efficiently and cost-effectively.
Review and document processes and procedures, and partner with engineering to implement changes effectively and with minimal disruption.
Disposition abnormal or atypical wafers for rework and ensure rework is completed promptly.
Collect and analyze data and recommend corrective action when required.
Review and maintain process controls using SPC, and prepare charts and graphs as needed.
Assist with troubleshooting tools and process issues in the plating area.
Participate in and recommend modifications to procedures or processes in support of continuous-improvement initiatives.
Assist with training and certifying operators on tools and manufacturing processes.
Collaborate with manufacturing or engineering to qualify or approve new processes or procedures and may assist with identifying production integration timelines.
Respond to inquiries from team members, managers, or departments.
Adhere to safety policies and procedures.
Perform other duties of a similar nature or level.