As a Director of Physical Design Engineering, you will set the technical outlook and lead execution for next-generation rack-to-chip physical solutions and the tooling needed for physical operations. You will lead integration of robotics, mechanical, and thermal-management solutions that enable Google ASICs, TPUs, GPUs, CPUs, storage, and advanced networking hardware within the data center roadmap. You will apply experience developing innovative mechanical and thermal solutions for computing hardware systems and deliver them at high velocity with quality and reliability. You will lead the development of a roadmap and mechanical and cooling solutions spanning chips, boards, racks, and data centers; anticipate fleet-level challenges; and advance AI hardware physical delivery and enclosure transformation, including robotics automation. You will guide cross-functional teams, align external ecosystems and suppliers, and help hardware scale reliably for global infrastructure. The role requires deep technical expertise in physical design, significant management experience, complex project and product delivery experience, and an understanding of performance, quality, and advanced mechanical-solution manufacturing. The AI and Infrastructure team delivers AI and infrastructure capabilities at scale, efficiency, reliability, and velocity for Google employees, Google Cloud customers, and Google users worldwide. Its work spans AI models, computing for global services, developer platforms, hyperscale computing, TPUs, Vertex AI for Google Cloud, global networking, data center operations, and systems research.
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Job Type
Full-time
Career Level
Director