About The Position

We are seeking an entry-level Photonic Packaging and Electro-Optics Assembly Engineer to support the assembly, packaging, testing, and characterization of photonic integrated circuit (PIC) devices and modules as well as Electo-Optics systems. This position is well suited for a recent graduate in optics and photonics, electrical engineering, applied physics, or a related discipline who is interested in developing hands-on expertise in photonic hardware. The engineer will work closely with photonic design, electrical, mechanical, and test engineers to assemble and evaluate photonic devices. The primary areas of responsibility will include fiber-to-PIC attachment and alignment, wire bonding, optical-component polishing, device testing, and dimensional and optical metrology.

Requirements

  • Bachelor's degree in optics and photonics, electrical engineering, applied physics, physics, or a closely related technical field.
  • Fundamental understanding of optics, photonics, optical fibers, and basic electrical concepts.
  • Interest in hands-on laboratory work involving precision assembly and testing.
  • Ability to work with small and delicate components under a microscope.
  • Strong attention to detail and the ability to follow documented procedures.
  • Ability to collect, organize, and clearly communicate experimental and process data.
  • Strong problem-solving, organizational, and technical communication skills.
  • Eligibility to work in the United States
  • Ability to pass a pre-employment background check.

Nice To Haves

  • Internship, co-op, academic research, or laboratory experience involving photonics, optics, microelectronics, semiconductor devices, or precision assembly.
  • Exposure to photonic integrated circuits, optoelectronic devices, or fiber-optic systems.
  • Familiarity with laboratory instruments such as optical power meters, laser sources, oscilloscopes, source-measure units, and optical spectrum analyzers.
  • Experience documenting laboratory procedures, test results, or manufacturing processes.

Responsibilities

  • Support the assembly and packaging of photonic integrated circuits and optoelectronic modules.
  • Perform fiber-to-PIC alignment, optical coupling, and attachment using precision positioning and alignment equipment.
  • Perform wire bonding and support other electrical interconnect and die-attachment processes.
  • Polish optical fibers, fiber arrays, PIC facets, and related optical components as required.
  • Conduct optical and electrical testing of packaged photonic devices and optoelectronic modules.
  • Perform dimensional, visual, and optical metrology using microscopes and other inspection equipment.
  • Collect, document, and analyze assembly and test data.
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