Photolithography Equipment Engineer

NXP Semiconductors•Chandler, AZ
•Onsite

About The Position

NXP’s Front End Operations plays an essential role in the company’s success by ensuring manufacturing excellence and delivery of high quality, scalable, and cost-competitive semiconductor devices to create a winning advantage for our Customers. This role is for a Photolithography Equipment Engineer in a high-volume semiconductor wafer manufacturing environment. Prior experience with semiconductor manufacturing process is required. Previous equipment experience with ASML Scanner PAS5500/400/700 Scanners is required.

Requirements

  • Prior experience with semiconductor manufacturing process is required.
  • Previous equipment experience with ASML Scanner PAS5500/400/700 Scanners is required.
  • Knowledge of Six-Sigma root cause problem solving, SPC, 8D, FMEAs
  • Must have a BS or MS degree in engineering or a degree in relevant field of studies
  • More than 5 years of process engineering experience in a similar high volume semiconductor manufacturing environment

Nice To Haves

  • Experience with Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM/KLA SL3/Archers/UVs/ASET/HRPs, Onto IRIS is desirable.

Responsibilities

  • Identification and reduction of reoccuring machine faults
  • Creation of hard down action plans driving to root cause
  • Developing and improving tool maintenance procedures
  • Training maintenance technicians
  • Reducing overall cost of equipment and scrap
  • Improving tool utilization and availability
  • Participating in and/or leading cross-functional and lean activity teams
  • Supporting process development activities
  • Sourcing and releasing new equipment
  • Training maintenance technicians
  • Working closely with Photo process team to identify and reduce source of process variation and implementing zero defect process
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